Package Intersil Q64.10x10E — Datenblatt

Plastic Packages for Integrated Circuits
Thin Plastic Quad Flatpack Package with Top Exposed Pad (TQFP-TEP)
5
D1 Q64.10x10E 7 64 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE WITH
TOP EXPOSED PAD (TQFP-TEP) D1/2 ACD
SYMBOL 7
E1
D2 13 4X NOM. MAX A E1/2
5 MIN 0.20 H A-B D E2 13 1.20 A1 0.05 A2 0.95 A
-H-0.05 2 / / 0.10 C ccc
-C-SIDE VIEW SEE DETAIL "B"
4
D 1.00 12 1.05 12.00 BSC 4 D1 10.00 BSC 7, 8 D2 7.49 BSC 13 E 12.00 BSC 4 E1 10.00 BSC 7, 8 L
11/13В° 0.15 D E2 TOP VIEW NOTES 7.49 BSC
0.45 13 0.60 N 64 e 0.50 BSC 0.75 b 0.17 0.22 0.27 b1 0.17 0.20 0.23 ccc 0.08 ddd 0.08 9 D/2
-D-Rev. 1 7/11 3 NOTES: -A-3 4
E
-Be 3
E/2 N/4 TIPS
0.20 C A-B D
4X SEE DETAIL "A"
8 PLACES BOTTOM VIEW
0В° MIN. -0.05 S 0.08/0.20 R. DATUM …