Package Intersil N68.95 — Datenblatt
68 Blei-Kunststoff-Chipträgerpaket
Package Outline Drawing (POD)
Parameter
| Family | PLCC |
| Pin Count | 68 |
| Weight | 5.0 g |
| Pitch | 1.27 mm |
| Peak Temperature | 225 °C |
| Package Index | N68.95 |
Modellreihe
Herstellerklassifikation
- Plastic Packages
