Package Outline Drawing
Y58.18x23
58 I/O 18mmx23mmx7.5mm CUSTOM HDA MODULE
Rev 3, 12/16
18.00 A DATUM A B 18 17 16 1514 13 12 1110 9 8 7 6 5 4 3 2 1 TERMINAL #A1
INDEX AREA
(9x11.5) 1
23.00 0.10 M C A B
22.60 В± 0.15 0.10 C 2X 0.40 REF DATUM B 16.00 0.10 C 2X 17.20
TOP VIEW 0.10 M C A B
BOTTOM VIEW 7.50 MAX
0.10 C 2 0.20 REF 1.00 0.20 REF SEATING PLANE 0.08 C C MAX 0.025
SIDE VIEW
NOTES:
1. All dimensions are in millimeters. 2. Represents the basic land grid pitch. 3. These 42 I/Os are centered in a fixed row and column matrix
at 1.0mm pitch BSC. 42 x 0.60 В± 0.05 4. Dimensioning and tolerancing per ASME Y14.5-2009. 3 5. Tolerance for exposed PAD edge location dimension on
page 3 is В±0.1mm. 3
42 x 0.60 В± 0.05 0.10 M C A B
0.05 M C TERMINAL TIP
0.100 R REF 1.00
DETAIL A 2 Plastic Packages for Integrated Circuits 12.00 A
B
C …
