Package Intersil Q156.14x20 — Datenblatt

Plastic Packages for Integrated Circuits Package Outline Drawing
Q156.14x20
156 LEAD LOW PLASTIC QUAD FLATPACK EXPOSED PAD PACKAGE (0.4mm LEAD PITCH) (LQFP-EP)
Rev 1, 10/16
22.00 BSC
20.00 BSC 1
6.000 18.00
-D-124 79 156 47 78 125 -B-A16.00
BSC 46 1 (6.00) 14.00
BSC 12.40
1 156 125
124 47
1 46 0.40 BSC 0.20 C A-B D 4X
4X +0.07
2 0.16 -0.03 78
79 EXPOSED
PAD
BOTTOM VIEW 0.20 H A-B D 0.08 M C A-B D TOP VIEW SEE
DETAIL "X" 0В° MIN 3.5В° В±3.5В° 0.08 C 12В° В±1В°
0.08 MIN -C-SEATING
PLANE 0.08/0.20
-HGAGE PLANE -0.05 0.09/0.20 S 1.60 MAX 0.25 0.20 MIN 1.40 В±0.05 12В° В±1В° 0.05/0.15 1.00 REF 0.60 В±0.15 DETAIL X'' SIDE VIEW (21.30)
(6.00) NOTES: …