Package Intersil Q128.14x20C — Datenblatt

Plastic Packages for Integrated Circuits Package Outline Drawing
Q128.14x20C
128 LOW PLASTIC QUAD FLATPACK PACKAGE WITH TOP EXPOSED PAD (TEP-LQFP)
Rev 0, 4/10
22.00
4 5
20.00 12.81 В±0.10
D 3 3 A
16.00
B
3
8.38 В±0.10 0.50 4X 0.20 C A-B D 14.00 4 5 EXPOSED PAD PIN 1 ID 4X TOP VIEW 0.20 H A-B D BOTTOM VIEW 0В° MIN.
1.60 MAX
1.40 В±0.05 / / 0.10 C
C SIDE VIEW 0.08 H 11/13В°
0.05 0.05/0.15 SEE DETAIL "A" 2 0.08
R. MIN.
0.20 MIN. 0.25
GAUGE PLANE
0.60 В± 0.15
0-7В° (1.00)
DETAIL "A"
SCALE: NONE (21.4) …