Package Intersil S3x3.9 — Datenblatt

Plastic Packages for Integrated Circuits Package Outline Drawing
S3x3.9
3X3 ARRAY 9 BUMP OPTICAL CHIP SCALE PACKAGE (OCSP)
Rev 7, 10/10
2.155 В±0.025 A1
CORNER 1.30 A 0.65 B
A1
CORNER 3 2 1.30 1 A
2.155 В±0.025 B
C TOP VIEW
0.30 В±0.03 5
0.15 M C A B
0.08 M C 0.65 BOTTOM VIEW 0.825 В±0.045 0.10 C
1.045 MAX SEATING PLANE C
0.16 В±0.03 0.10 C SIDE VIEW (1.30)
(1.30)
(0.65)
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference only.
2. Dimensioning and tolerancing conform to ASME Y 14.5M-1994
3. Primary datum C and seating plane are defined by the spherical
crowns of the contact balls. …