Package Intersil V409.18x18 — Datenblatt

Plastic Packages for Integrated Circuits Package Outline Drawing
V409.18x18
409 LOW PROFILE FINE PITCH PLASTIC BALL GRID ARRAY PACKAGE (LFBGA)
Rev 0, 3/12
PIN A1 CORNER SYMBOL COMMON DIMENSIONS
Package LFBGA
X E 18.00 Y D 18.00 Total Thickness A 1.400 MAX Mold Thickness M 0.700 Ref. Substrate Thickness S 0.260 Ref. A1 0.270 ~ 0.370 b 0.380 ~ 0.480 aaa 0.150 Body Size
Ball Pitch 0.800 Ball Diameter 0.400 Stand Off
Ball Width
Package Edge Tolerance TOP VIEW Mold Flatness bbb 0.200 Coplanarity ddd 0.120 Ball Offset (Package) eee 0.150 Ball Offset (Ball) fff 0.080 Ball Count
ddd C bbb C M Edge Ball Center to Center A
A1 C S SIDE VIEW 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 D D1 e AA
Y
W
V
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N
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