Package Intersil V256.13.5x13.5 — Datenblatt

HerstellerIntersil
SerieBGA
ArtikelnummerV256.13.5x13.5
Package Intersil V256.13.5x13.5

256 Low Profile, Fine Pitch Kunststoffkugelgitter-Array-Paket

Package Outline Drawing (POD)

PDF, 211 Kb
Auszug aus dem Dokument

Parameter

FamilyLFBGA
Pin Count256
Height max1.70 mm
Weight0.722 g
Pitch0.80 mm
Peak Temperature235 °C
Lead Free Peak Temperature260 °C
FeaturesLow Profile, Fine
Package IndexV256.13.5X13.5

Modellreihe

Herstellerklassifikation

  • Plastic Packages