Datasheet Texas Instruments 66AK2H12DAAWA24 — Datenblatt
Hersteller | Texas Instruments |
Serie | 66AK2H12 |
Artikelnummer | 66AK2H12DAAWA24 |
Multicore DSP + ARM KeyStone II System-on-Chip (SoC) 1517-FCBGA -40 bis 100
Datenblätter
66AK2Hxx Multicore DSP+ARMВ® KeyStone II System-on-Chip (SoC) datasheet
PDF, 2.4 Mb, Revision: F, Datei veröffentlicht: Jun 2, 2017
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Preise
Status
Lifecycle Status | Active (Recommended for new designs) |
Manufacture's Sample Availability | No |
Verpackung
Pin | 1517 | 1517 | 1517 |
Package Type | AAW | AAW | AAW |
Package QTY | 21 | 21 | 21 |
Carrier | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) |
Device Marking | 66AK2H12AAW | A1.2GHZ/1.4GHZ | @2012 TI |
Width (mm) | 40 | 40 | 40 |
Length (mm) | 40 | 40 | 40 |
Thickness (mm) | 3.07 | 3.07 | 3.07 |
Mechanical Data | Herunterladen | Herunterladen | Herunterladen |
Parameter
ARM CPU | 4 ARM Cortex-A15 |
ARM MHz | 1200,1400 Max. |
Applications | Automation and Process,Avionics and Defense,Communications and Telecom,Consumer Electronics,Industrial,Medical,Security,Space |
DRAM | DDR3,DDR3L |
DSP | 8 C66x |
DSP MHz | 1200 Max. |
EMAC | 4-port 1Gb Switch |
Hardware Accelerators | Packet Accelerator,Security Accelerator |
I2C | 3 |
On-Chip L2 Cache | 4096 KB (ARM Cluster),1024 KB (per C66x DSP core) |
Operating Systems | Integrity,Linux,SYS/BIOS,VxWorks |
Operating Temperature Range | -40 to 100,0 to 85 C |
Other On-Chip Memory | 6144 KB |
PCI/PCIe | 2 PCIe Gen2 |
Rating | Catalog |
SPI | 3 |
UART | 2 SCI |
USB | 1 |
Öko-Plan
RoHS | Compliant |
Design Kits und Evaluierungsmodule
- JTAG Emulators/ Analyzers: TMDSEMU200-U
XDS200 USB Debug Probe
Lifecycle Status: Active (Recommended for new designs) - JTAG Emulators/ Analyzers: TMDSEMU560V2STM-UE
XDS560v2 System Trace USB & Ethernet Debug Probe
Lifecycle Status: Active (Recommended for new designs) - JTAG Emulators/ Analyzers: TMDSEMU560V2STM-U
XDS560v2 System Trace USB Debug Probe
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: EVMK2H
66AK2H Evaluation Modules
Lifecycle Status: Active (Recommended for new designs)
Anwendungshinweise
- Power Consumption Summary for 66AK2Hx System-on-Chip (SoC) Device FamilyPDF, 47 Kb, Datei veröffentlicht: Sep 28, 2017
This application report discusses estimating the power consumption of Texas Instruments' K2Hx Digital Signal Processors (DSP) using a provided device-specific power spreadsheet. Note that the power model is applicable for all silicon revisions. - Keystone EDMA FAQPDF, 1.3 Mb, Datei veröffentlicht: Sep 1, 2016
This document is a collection of frequently asked questions (FAQs) on enhanced direct memory access (EDMA) on KeyStoneв„ў I (KS1) and KeyStone II (KS2) devices, along with useful collateral and software reference links. - Keystone NDK FAQPDF, 54 Kb, Datei veröffentlicht: Oct 3, 2016
This document is a collection of frequently asked questions (FAQ) on running the NDK examples on the KeyStoneв„ў family of devices. - Throughput Performance Guide for KeyStone II Devices (Rev. B)PDF, 866 Kb, Revision: B, Datei veröffentlicht: Dec 22, 2015
This application report analyzes various performance measurements of the KeyStone II family of processors. It provides a throughput analysis of the various support peripherals to different end-points and memory access. - Keystone II DDR3 Debug GuidePDF, 143 Kb, Datei veröffentlicht: Oct 16, 2015
This guide provides tools for use when debugging a failing DDR3 interface on a KeyStone II device. - Power Management of KS2 Device (Rev. C)PDF, 61 Kb, Revision: C, Datei veröffentlicht: Jul 15, 2016
This application report lists the steps to enable Class 0 Temperature Compensation (Class 0 TC) mode of SmartReflexв„ў Subsystem (SRSS) module available on such devices. - Keystone II DDR3 InitializationPDF, 73 Kb, Datei veröffentlicht: Jan 26, 2015
This application report provides a step-to-step initialization guide for the Keystone II device DDR3 SDRAM controller. - Hardware Design Guide for KeyStone II DevicesPDF, 1.8 Mb, Datei veröffentlicht: Mar 24, 2014
- SERDES Link Commissioning on KeyStone I and II DevicesPDF, 138 Kb, Datei veröffentlicht: Apr 13, 2016
The serializer-deserializer (SerDes) performs serial-to-parallel conversions on data received from a peripheral device and parallel-to-serial conversion on data received from the CPU. This application report explains the SerDes transmit and receive parameters tuning, tools and some debug techniques for TI Keystone I and Keystone II devices. - PCIe Use Cases for KeyStone DevicesPDF, 320 Kb, Datei veröffentlicht: Dec 13, 2011
- The C6000 Embedded Application Binary Interface Migration Guide (Rev. A)PDF, 20 Kb, Revision: A, Datei veröffentlicht: Nov 10, 2010
The C6000 compiler tools support a new ELF-based ABI named EABI. Prior to this time, the compiler only supported a single ABI, which is now named COFF ABI. The following compelling best-in-class features are available under the C6000 EABI:GeneralZero-init globals: “int gvar;” gets set to 0 before main runs.Dynamic linking: Add code to a running system.Native ROM - Clocking Design Guide for KeyStone DevicesPDF, 1.5 Mb, Datei veröffentlicht: Nov 9, 2010
- Optimizing Loops on the C66x DSPPDF, 585 Kb, Datei veröffentlicht: Nov 9, 2010
- DDR3 Design Requirements for KeyStone Devices (Rev. B)PDF, 582 Kb, Revision: B, Datei veröffentlicht: Jun 5, 2014
- Multicore Programming Guide (Rev. B)PDF, 1.8 Mb, Revision: B, Datei veröffentlicht: Aug 29, 2012
As application complexity continues to grow, we have reached a limit on increasing performance by merely scaling clock speed. To meet the ever-increasing processing demand, modern System-On-Chip solutions contain multiple processing cores. The dilemma is how to map applications to multicore devices. In this paper, we present a programming methodology for converting applications to run on multicore - Processor SDK RTOS Audio Benchmark Starter KitPDF, 530 Kb, Datei veröffentlicht: Apr 12, 2017
The TI TMS320C6000в„ў Digital Signal Processors (DSPs) have many architectural advantages that make them ideal for computation-intensive real-time applications that are commonly used in audio processing application. This application notes describes Audio Benchmark Starterkit software that is intended to provide an easy and quick way to benchmark key audio functions on C66x and C674x DSP device - TI DSP BenchmarkingPDF, 62 Kb, Datei veröffentlicht: Jan 13, 2016
This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms.
Modellreihe
Serie: 66AK2H12 (10)
Herstellerklassifikation
- Semiconductors > Processors > Digital Signal Processors > C6000 DSP + ARM Processors > 66AK2x