Datasheet Texas Instruments TMP007 — Datenblatt
| Hersteller | Texas Instruments |
| Serie | TMP007 |
Kontaktloser Infrarot-Thermopile-Temperatursensor mit integrierter Mathematik-Engine im WCSP-Paket
Datenblätter
TMP007 Infrared Thermopile Sensor with Integrated Math Engine datasheet
PDF, 1.3 Mb, Revision: C, Datei veröffentlicht: Jul 28, 2015
Status
| TMP007AIYZFR | TMP007AIYZFT | |
|---|---|---|
| Lifecycle Status | NRND (Not recommended for new designs) | NRND (Not recommended for new designs) |
| Manufacture's Sample Availability | No | No |
Verpackung
| TMP007AIYZFR | TMP007AIYZFT | |
|---|---|---|
| N | 1 | 2 |
| Pin | 8 | 8 |
| Package Type | YZF | YZF |
| Industry STD Term | DSBGA | DSBGA |
| JEDEC Code | S-XBGA-N | S-XBGA-N |
| Package QTY | 3000 | 250 |
| Carrier | LARGE T&R | SMALL T&R |
| Device Marking | TMP007 | TMP007 |
| Width (mm) | 1.75 | 1.75 |
| Length (mm) | 1.75 | 1.75 |
| Pitch (mm) | .5 | .5 |
| Max Height (mm) | .625 | .625 |
| Mechanical Data | Herunterladen | Herunterladen |
Öko-Plan
| TMP007AIYZFR | TMP007AIYZFT | |
|---|---|---|
| RoHS | Compliant | Compliant |
Anwendungshinweise
- TMP006 and TMP007: Through-Hole Mounting MethodPDF, 1.8 Mb, Datei veröffentlicht: Sep 1, 2016
This applicationnotedescribesa new methodof mountingTMP007WCSPdie on the printed-circuitboard(PCB).The advantagesof the new methodare describedand mountingrecommendationsare provided.All of the followingrecommendationsand conclusionsare also true for TMP006parts. - AN-1112 DSBGA Wafer Level Chip Scale Package (Rev. AG)PDF, 13.7 Mb, Revision: AG, Datei veröffentlicht: Aug 12, 2015
- Understanding the I2C BusPDF, 124 Kb, Datei veröffentlicht: Jun 30, 2015
Modellreihe
Serie: TMP007 (2)
Herstellerklassifikation
- Semiconductors> Sensing Products> Temperature Sensors> IR & Probe Temperature Sensors