Datasheet Texas Instruments SN74CBT16861 — Datenblatt

HerstellerTexas Instruments
SerieSN74CBT16861
Datasheet Texas Instruments SN74CBT16861

20-Bit-FET-Busschalter

Datenblätter

20-Bit FET Bus Switch datasheet
PDF, 402 Kb, Revision: C, Datei veröffentlicht: Oct 23, 2000
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Preise

Status

SN74CBT16861DGGRSN74CBT16861DGVRSN74CBT16861DLSN74CBT16861DLR
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNoNo

Verpackung

SN74CBT16861DGGRSN74CBT16861DGVRSN74CBT16861DLSN74CBT16861DLR
N1234
Pin48484848
Package TypeDGGDGVDLDL
Industry STD TermTSSOPTVSOPSSOPSSOP
JEDEC CodeR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-G
Package QTY20002000251000
CarrierLARGE T&RLARGE T&RTUBELARGE T&R
Device MarkingCBT16861CY861CBT16861CBT16861
Width (mm)6.14.47.497.49
Length (mm)12.59.715.8815.88
Thickness (mm)1.151.052.592.59
Pitch (mm).5.4.635.635
Max Height (mm)1.21.22.792.79
Mechanical DataHerunterladenHerunterladenHerunterladenHerunterladen

Parameter

Parameters / ModelsSN74CBT16861DGGR
SN74CBT16861DGGR
SN74CBT16861DGVR
SN74CBT16861DGVR
SN74CBT16861DL
SN74CBT16861DL
SN74CBT16861DLR
SN74CBT16861DLR
Bandwidth, MHz200200200200
Configuration1:1 SPST1:1 SPST1:1 SPST1:1 SPST
Input/Ouput Voltage(Max), V5.55.55.55.5
Input/Output Continuous Current(Max), mA128128128128
Input/Output OFF-state Capacitance(Typ), pF5.55.55.55.5
Number of Channels20202020
OFF-state leakage current(Max), µA1111
ON-state leakage current(Max), µA1111
Operating Temperature Range, C-40 to 85-40 to 85-40 to 85-40 to 85
Package GroupTSSOPTVSOPSSOPSSOP
Package Size: mm2:W x L, PKG48TSSOP: 101 mm2: 8.1 x 12.5(TSSOP)48TVSOP: 62 mm2: 6.4 x 9.7(TVSOP)48SSOP: 164 mm2: 10.35 x 15.88(SSOP)48SSOP: 164 mm2: 10.35 x 15.88(SSOP)
RatingCatalogCatalogCatalogCatalog
Ron(Max), Ohms22222222
Ron(Typ), Ohms5555
Supply Current(Max), uA1111
Supply Range, Max5.55.55.55.5
VIH(Min), V2222
VIL(Max), V0.80.80.80.8
Vdd(Max), V5.55.55.55.5
Vdd(Min), V4444
Vss(Max), VN/AN/AN/AN/A
Vss(Min), VN/AN/AN/AN/A

Öko-Plan

SN74CBT16861DGGRSN74CBT16861DGVRSN74CBT16861DLSN74CBT16861DLR
RoHSCompliantCompliantCompliantCompliant

Anwendungshinweise

  • Flexible Voltage-Level Translation With CBT Family Devices
    PDF, 40 Kb, Datei veröffentlicht: Jul 20, 1999
    Voltage translation between buses with incompatible logic levels can be accomplished using Texas Instruments (TI) translation-voltage clamps (TVC) or standard crossbar technology (CBT) devices. CBT devices in this application offer flexibility in designs, protection of circuits that are sensitive to high-state voltage-level overshoots, and cost efficiency.
  • 5-V To 3.3-V Translation With the SN74CBTD3384 (Rev. B)
    PDF, 35 Kb, Revision: B, Datei veröffentlicht: Mar 1, 1997
    The emergence of low-voltage technology required existing 5-V systems to interact with 3.3-V systems. Compatibility issues of mixed-mode operation created the need for 5-V to 3.3-V translation. Buffers and transceivers serve as effective translators. While providing additional drive, these devices also add propagation delay and require directional control. In cases where additional drive is not
  • 3.3-V to 2.5-V Translation with Texas Instruments Crossbar Technology (Rev. A)
    PDF, 32 Kb, Revision: A, Datei veröffentlicht: Apr 3, 1998
  • VOLTAGE LEVEL TRANSLATION (SL) - Family
    PDF, 111 Kb, Datei veröffentlicht: Sep 21, 2011
  • Bus FET Switch Solutions for Live Insertion Applications
    PDF, 300 Kb, Datei veröffentlicht: Feb 7, 2003
    In today?s competitive computing and networking industry, any equipment downtime due to component interconnects or bus failures impedes communication, hinders productivity and hampers financial growth. In recognizing this increasingly costly unplanned downtime, the industry introduced live-insertion technology to minimize the impact of any such failures. The live-insertion feature enables a networ
  • 16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
    PDF, 895 Kb, Revision: B, Datei veröffentlicht: May 22, 2002
    TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa

Modellreihe

Herstellerklassifikation

  • Semiconductors> Switches and Multiplexers> Analog Switches/Muxes