Datasheet Texas Instruments SN74CBT16232 — Datenblatt

HerstellerTexas Instruments
SerieSN74CBT16232
Datasheet Texas Instruments SN74CBT16232

Synchroner 16-Bit 1-aus-2-FET-Multiplexer / Demultiplexer

Datenblätter

Synchronous 16-Bit 1-of-2 FET Multiplexer/Demultiplexer datasheet
PDF, 304 Kb, Revision: N, Datei veröffentlicht: Jun 25, 2007
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Preise

Status

SN74CBT16232DGGRSN74CBT16232DLSN74CBT16232DLR
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNo

Verpackung

SN74CBT16232DGGRSN74CBT16232DLSN74CBT16232DLR
N123
Pin565656
Package TypeDGGDLDL
Industry STD TermTSSOPSSOPSSOP
JEDEC CodeR-PDSO-GR-PDSO-GR-PDSO-G
Package QTY2000201000
CarrierLARGE T&RTUBELARGE T&R
Device MarkingCBT16232CBT16232CBT16232
Width (mm)6.17.497.49
Length (mm)1418.4118.41
Thickness (mm)1.152.592.59
Pitch (mm).5.635.635
Max Height (mm)1.22.792.79
Mechanical DataHerunterladenHerunterladenHerunterladen

Parameter

Parameters / ModelsSN74CBT16232DGGR
SN74CBT16232DGGR
SN74CBT16232DL
SN74CBT16232DL
SN74CBT16232DLR
SN74CBT16232DLR
Bandwidth, MHz200200200
Bandwidth(Max), MHz200200200
Configuration2:1 SPDT2:1 SPDT2:1 SPDT
Input/Ouput Voltage(Max), V5.55.55.5
Input/Output Continuous Current(Max), mA128128128
Input/Output OFF-state Capacitance(Typ), pF444
Number of Channels161616
OFF-state leakage current(Max), µA111
Operating Temperature Range, C-40 to 85-40 to 85-40 to 85
Package GroupTSSOPSSOPSSOP
Package Size: mm2:W x L, PKG56TSSOP: 113 mm2: 8.1 x 14(TSSOP)56SSOP: 191 mm2: 10.35 x 18.42(SSOP)56SSOP: 191 mm2: 10.35 x 18.42(SSOP)
RatingCatalogCatalogCatalog
Ron(Max), Ohms202020
Ron(Typ), Ohms555
Supply Current(Max), uA333
Supply Range, Max5.55.55.5
VIH(Min), V222
VIL(Max), V0.80.80.8
Vdd(Max), V5.55.55.5
Vdd(Min), V444
Vss(Max), VN/AN/AN/A
Vss(Min), VN/AN/AN/A

Öko-Plan

SN74CBT16232DGGRSN74CBT16232DLSN74CBT16232DLR
RoHSCompliantCompliantCompliant

Anwendungshinweise

  • Flexible Voltage-Level Translation With CBT Family Devices
    PDF, 40 Kb, Datei veröffentlicht: Jul 20, 1999
    Voltage translation between buses with incompatible logic levels can be accomplished using Texas Instruments (TI) translation-voltage clamps (TVC) or standard crossbar technology (CBT) devices. CBT devices in this application offer flexibility in designs, protection of circuits that are sensitive to high-state voltage-level overshoots, and cost efficiency.
  • 5-V To 3.3-V Translation With the SN74CBTD3384 (Rev. B)
    PDF, 35 Kb, Revision: B, Datei veröffentlicht: Mar 1, 1997
    The emergence of low-voltage technology required existing 5-V systems to interact with 3.3-V systems. Compatibility issues of mixed-mode operation created the need for 5-V to 3.3-V translation. Buffers and transceivers serve as effective translators. While providing additional drive, these devices also add propagation delay and require directional control. In cases where additional drive is not
  • 3.3-V to 2.5-V Translation with Texas Instruments Crossbar Technology (Rev. A)
    PDF, 32 Kb, Revision: A, Datei veröffentlicht: Apr 3, 1998
  • VOLTAGE LEVEL TRANSLATION (SL) - Family
    PDF, 111 Kb, Datei veröffentlicht: Sep 21, 2011
  • Bus FET Switch Solutions for Live Insertion Applications
    PDF, 300 Kb, Datei veröffentlicht: Feb 7, 2003
    In today?s competitive computing and networking industry, any equipment downtime due to component interconnects or bus failures impedes communication, hinders productivity and hampers financial growth. In recognizing this increasingly costly unplanned downtime, the industry introduced live-insertion technology to minimize the impact of any such failures. The live-insertion feature enables a networ
  • 16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
    PDF, 895 Kb, Revision: B, Datei veröffentlicht: May 22, 2002
    TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa

Modellreihe

Herstellerklassifikation

  • Semiconductors> Switches and Multiplexers> Analog Switches/Muxes