Datasheet Texas Instruments SN65LVDS31D — Datenblatt

HerstellerTexas Instruments
SerieSN65LVDS31
ArtikelnummerSN65LVDS31D
Datasheet Texas Instruments SN65LVDS31D

400 Mbit / s LVDS Quad Hochgeschwindigkeits-Differenzialtreiber 16-SOIC -40 bis 85

Datenblätter

SNx5LVDS31, SN65LVDS3487, SN65LVDS9638: High-Speed Differential Line Drivers datasheet
PDF, 1.9 Mb, Revision: M, Datei veröffentlicht: Jul 29, 2014
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Preise

Status

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityYes

Verpackung

Pin16
Package TypeD
Industry STD TermSOIC
JEDEC CodeR-PDSO-G
Package QTY40
CarrierTUBE
Device MarkingLVDS31
Width (mm)3.91
Length (mm)9.9
Thickness (mm)1.58
Pitch (mm)1.27
Max Height (mm)1.75
Mechanical DataHerunterladen

Parameter

Device TypeDriver
ESD HBM8 kV
FunctionDriver
ICC(Max)35 mA
Input SignalLVTTL
No. of Tx4
Operating Temperature Range-40 to 85 C
Output SignalLVDS
Package GroupSOIC
Package Size: mm2:W x L16SOIC: 59 mm2: 6 x 9.9(SOIC) PKG
ProtocolsLVDS
Signaling Rate400 Mbps

Öko-Plan

RoHSCompliant

Design Kits und Evaluierungsmodule

  • Evaluation Modules & Boards: SN65LVDS31-32BEVM
    SN65LVDS31-32BEVM Evaluation Module for LVDS31 and LVDS32B
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: SN65LVDS31-32EVM
    SN65LVDS31-32EVM Evaluation Module for LVDS31 and LVDS32
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: SN65LVDS31-33EVM
    Evaluation Module for SN65LVDS31 and SN65LVDS33
    Lifecycle Status: Active (Recommended for new designs)

Anwendungshinweise

  • Performance of LVDS with Different Cables (Rev. B)
    PDF, 246 Kb, Revision: B, Datei veröffentlicht: Feb 11, 2002
    This application report focuses on cable for use with LVDS devices rather than printed-circuit board interconnections. After a brief introduction to LVDS, the signal quality of seven different cables is evaluated using eye pattern measurements and TI's LVDS evaluation modules (EVMs). Since data transmission cable covers a wide range of cost and performance, this paper provides guidance for cable s
  • LVDS Multidrop Connections (Rev. A)
    PDF, 809 Kb, Revision: A, Datei veröffentlicht: Feb 11, 2002
    This application report describes design considerations for low-voltage differential swing (LVDS) multidrop connections. The report describes the maximum number of receivers possible versus signaling rate, signal quality, line length, output jitter, and common-mode voltage range when multidrop testing on a single LVDS line driver transmitting to numerous daisy-chained LVDS receivers.The LVDS rec

Modellreihe

Herstellerklassifikation

  • Semiconductors > Interface > LVDS/M-LVDS/PECL > Buffers, Drivers/Receivers and Cross-Points