Datasheet Texas Instruments SN54LVTH16952 — Datenblatt

HerstellerTexas Instruments
SerieSN54LVTH16952
Datasheet Texas Instruments SN54LVTH16952

3.3-V ABT 16-BIT-registrierte Transceiver mit 3-Zustands-Ausgängen

Datenblätter

3.3-V ABT 16-Bit Registered Transceivers With 3-State Outputs datasheet
PDF, 849 Kb, Revision: G, Datei veröffentlicht: Apr 10, 2000
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Preise

Status

5962-9684901QXASNJ54LVTH16952WD
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNo

Verpackung

5962-9684901QXASNJ54LVTH16952WD
N12
Pin5656
Package TypeWDWD
Industry STD TermCFPCFP
JEDEC CodeR-GDFP-FR-GDFP-F
Package QTY11
CarrierTUBETUBE
Device Marking5962-9684901QXSNJ54LVTH16952
Width (mm)9.669.66
Length (mm)18.4218.42
Thickness (mm)2.482.48
Pitch (mm).635.635
Max Height (mm)3.053.05
Mechanical DataHerunterladenHerunterladen

Parameter

Parameters / Models5962-9684901QXA
5962-9684901QXA
SNJ54LVTH16952WD
SNJ54LVTH16952WD
Bits1616
Operating Temperature Range, C-55 to 125-55 to 125
Package GroupCFPCFP
Package Size: mm2:W x L, PKGSee datasheet (CFP)See datasheet (CFP)
RatingMilitaryMilitary
Schmitt TriggerNoNo
Technology FamilyLVTLVT
VCC(Max), V3.63.6
VCC(Min), V2.72.7

Öko-Plan

5962-9684901QXASNJ54LVTH16952WD
RoHSSee ti.comSee ti.com

Anwendungshinweise

  • Input and Output Characteristics of Digital Integrated Circuits
    PDF, 1.7 Mb, Datei veröffentlicht: Oct 1, 1996
    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
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    To address the need for a complete low-voltage interface solution, Texas Instruments has developed a new generation of logic devices capable of mixed-mode operation. The LVT series relies on a state-of-the-art submicron BiCMOS process to provide up to a 90% reduction in static power dissipation over ABT. LVT devices solve the system need for a transparent seam between the low-voltage and 5-V secti
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  • TI IBIS File Creation Validation and Distribution Processes
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    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
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    PDF, 209 Kb, Datei veröffentlicht: May 10, 2002
    Many telecom and networking applications require that cards be inserted and extracted from a live backplane without interrupting data or damaging components. To achieve this interface terminals of the card must be electrically isolated from the bus system during insertion or extraction from the backplane. To facilitate this Texas Instruments provides bus-interface and logic devices with features
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    PDF, 105 Kb, Revision: A, Datei veröffentlicht: Aug 1, 1997
    The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
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    PDF, 614 Kb, Revision: C, Datei veröffentlicht: Dec 2, 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, Datei veröffentlicht: Jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • 16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
    PDF, 895 Kb, Revision: B, Datei veröffentlicht: May 22, 2002
    TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa
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    PDF, 260 Kb, Revision: D, Datei veröffentlicht: Jun 23, 2016

Modellreihe

Serie: SN54LVTH16952 (2)

Herstellerklassifikation

  • Semiconductors> Space & High Reliability> Logic Products> Buffers/Drivers/Transceivers> Transceivers