Datasheet Texas Instruments SN54LS14 — Datenblatt

HerstellerTexas Instruments
SerieSN54LS14
Datasheet Texas Instruments SN54LS14

Hex-Schmitt-Trigger-Wechselrichter

Datenblätter

SNx414 and SNx4LS14 Hex Schmitt-Trigger Inverters datasheet
PDF, 1.4 Mb, Revision: C, Datei veröffentlicht: Nov 30, 2016
Auszug aus dem Dokument

Preise

Status

5962-9665801Q2A5962-9665801QCA5962-9665801QDAJM38510/31302BCAM38510/31302BCASN54LS14JSNJ54LS14FKSNJ54LS14JSNJ54LS14W
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNoNoNoNoNoNoNo

Verpackung

5962-9665801Q2A5962-9665801QCA5962-9665801QDAJM38510/31302BCAM38510/31302BCASN54LS14JSNJ54LS14FKSNJ54LS14JSNJ54LS14W
N123456789
Pin201414141414201414
Package TypeFKJWJJJFKJW
Industry STD TermLCCCCDIPCFPCDIPCDIPCDIPLCCCCDIPCFP
JEDEC CodeS-CQCC-NR-GDIP-TR-GDFP-FR-GDIP-TR-GDIP-TR-GDIP-TS-CQCC-NR-GDIP-TR-GDFP-F
Package QTY111111111
CarrierTUBETUBETUBETUBETUBETUBETUBETUBETUBE
Device Marking5962-5962-9665801QCSNJ54LS14WJM38510/31302BCASN54LS14JSNJ54LSASNJ54LS14W
Width (mm)8.896.675.976.676.676.678.896.675.97
Length (mm)8.8919.569.2119.5619.5619.568.8919.569.21
Thickness (mm)1.834.571.594.574.574.571.834.571.59
Pitch (mm)1.272.541.272.542.542.541.272.541.27
Max Height (mm)2.035.082.035.085.085.082.035.082.03
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Parameter

Parameters / Models5962-9665801Q2A
5962-9665801Q2A
5962-9665801QCA
5962-9665801QCA
5962-9665801QDA
5962-9665801QDA
JM38510/31302BCA
JM38510/31302BCA
M38510/31302BCA
M38510/31302BCA
SN54LS14J
SN54LS14J
SNJ54LS14FK
SNJ54LS14FK
SNJ54LS14J
SNJ54LS14J
SNJ54LS14W
SNJ54LS14W
Bits666666666
Input TypeTTLTTLTTLTTLTTLTTLTTLTTLTTL
Operating Temperature Range, C-55 to 125-55 to 125-55 to 125-55 to 125-55 to 125-55 to 125-55 to 125-55 to 125-55 to 125
Output TypeTTLTTLTTLTTLTTLTTLTTLTTLTTL
Package GroupLCCCCDIPCFPCDIPCDIPCDIPLCCCCDIPCFP
Package Size: mm2:W x L, PKG20LCCC: 79 mm2: 8.89 x 8.89(LCCC)See datasheet (CDIP)See datasheet (CFP)See datasheet (CDIP)See datasheet (CDIP)See datasheet (CDIP)20LCCC: 79 mm2: 8.89 x 8.89(LCCC)See datasheet (CDIP)See datasheet (CFP)
RatingMilitaryMilitaryMilitaryMilitaryMilitaryMilitaryMilitaryMilitaryMilitary
Schmitt TriggerYesYesYesYesYesYesYesYesYes
Technology FamilyLSLSLSLSLSLSLSLSLS
VCC(Max), V5.55.55.55.55.55.55.55.55.5
VCC(Min), V4.54.54.54.54.54.54.54.54.5
Voltage(Nom), V555555555

Öko-Plan

5962-9665801Q2A5962-9665801QCA5962-9665801QDAJM38510/31302BCAM38510/31302BCASN54LS14JSNJ54LS14FKSNJ54LS14JSNJ54LS14W
RoHSSee ti.comSee ti.comSee ti.comSee ti.comSee ti.comSee ti.comSee ti.comSee ti.comSee ti.com

Anwendungshinweise

  • Understanding Schmitt Triggers
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  • Designing with the SN54/74LS123 (Rev. A)
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    The Texas Instruments (TI) SN54/74LS123 dual retriggerable monostable multivibrator is a one-shot device capable of verylong output pulses and up to 100% duty cycle. The ?LS123 also features dc triggering from gated low-level active A andhigh-level active B inputs and provides a clear input that terminates the output pulse of any predetermined time independentof timing components R ext and
  • Input and Output Characteristics of Digital Integrated Circuits
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    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
  • TI IBIS File Creation Validation and Distribution Processes
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    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
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    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, Revision: C, Datei veröffentlicht: Dec 2, 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, Datei veröffentlicht: Jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Designing With Logic (Rev. C)
    PDF, 186 Kb, Revision: C, Datei veröffentlicht: Jun 1, 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • Introduction to Logic
    PDF, 93 Kb, Datei veröffentlicht: Apr 30, 2015

Modellreihe

Herstellerklassifikation

  • Semiconductors> Space & High Reliability> Logic Products> Buffers/Drivers/Transceivers> Buffer Drivers