Datasheet Texas Instruments SN54AS30 — Datenblatt

HerstellerTexas Instruments
SerieSN54AS30
Datasheet Texas Instruments SN54AS30

Positive NAND-Gatter mit 8 Eingängen

Datenblätter

8-Input Positive-NAND Gates, SN54ALS30A, SN54AS30, SN74ALS30A, SN74AS30 datasheet
PDF, 1.1 Mb, Revision: E, Datei veröffentlicht: Nov 2, 2012
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Preise

Status

5962-9755801QCASNJ54AS30J
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNo

Verpackung

5962-9755801QCASNJ54AS30J
N12
Pin1414
Package TypeJJ
Industry STD TermCDIPCDIP
JEDEC CodeR-GDIP-TR-GDIP-T
Package QTY11
CarrierTUBETUBE
Device MarkingSNJ54AS30JA
Width (mm)6.676.67
Length (mm)19.5619.56
Thickness (mm)4.574.57
Pitch (mm)2.542.54
Max Height (mm)5.085.08
Mechanical DataHerunterladenHerunterladen

Parameter

Parameters / Models5962-9755801QCA
5962-9755801QCA
SNJ54AS30J
SNJ54AS30J
Input TypeTTLTTL
Operating Temperature Range, C-55 to 125-55 to 125
Output TypeTTLTTL
Package GroupCDIPCDIP
Package Size: mm2:W x L, PKGSee datasheet (CDIP)See datasheet (CDIP)
RatingMilitaryMilitary
Schmitt TriggerNoNo
Technology FamilyASAS
VCC(Max), V5.55.5
VCC(Min), V4.54.5

Öko-Plan

5962-9755801QCASNJ54AS30J
RoHSSee ti.comSee ti.com

Anwendungshinweise

  • Input and Output Characteristics of Digital Integrated Circuits
    PDF, 1.7 Mb, Datei veröffentlicht: Oct 1, 1996
    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
  • Advanced Schottky (ALS and AS) Logic Families
    PDF, 1.9 Mb, Datei veröffentlicht: Aug 1, 1995
    This document introduces the advanced Schottky family of clamped TTL integrated circuits (ICs). Detailed electrical characteristics of the 'AS and 'ALS devices with table formats are provided. Guidelines for designing high-performance digital systems using the Advanced Schottky family are given along with a brief summary of the solutions to most design decisions needed to implement systems using t
  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Kb, Datei veröffentlicht: Aug 29, 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
  • Advanced Schottky Load Management
    PDF, 277 Kb, Datei veröffentlicht: Feb 1, 1997
    Designers of high-speed systems that include advanced Schottky (AS) devices must consider the operating environment in their work. They must be aware of the individual device characteristics and their interaction with other devices. This document provides a detailed discussion of the waveform characteristics equivalent circuit models transmission line fanout and termination for AS load manageme
  • Live Insertion
    PDF, 150 Kb, Datei veröffentlicht: Oct 1, 1996
    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, Revision: C, Datei veröffentlicht: Dec 2, 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, Datei veröffentlicht: Jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Designing With Logic (Rev. C)
    PDF, 186 Kb, Revision: C, Datei veröffentlicht: Jun 1, 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • Introduction to Logic
    PDF, 93 Kb, Datei veröffentlicht: Apr 30, 2015

Modellreihe

Serie: SN54AS30 (2)

Herstellerklassifikation

  • Semiconductors> Space & High Reliability> Logic Products> Gate Products