Datasheet Texas Instruments SN54ALS30A — Datenblatt

Hersteller	Texas Instruments
Serie	SN54ALS30A

Datenblätter

Preise

Status

Verpackung

Parameter

Parameters / Models	5962-86837012A	5962-8683701DA	JM38510/37004B2A	JM38510/37004BCA	M38510/37004B2A	M38510/37004BCA	SN54ALS30AJ	SNJ54ALS30AFK	SNJ54ALS30AJ	SNJ54ALS30AW
Input Type	TTL	TTL	TTL	TTL	TTL	TTL	TTL	TTL	TTL	TTL
Operating Temperature Range, C	-55 to 125	-55 to 125	-55 to 125	-55 to 125	-55 to 125	-55 to 125	-55 to 125	-55 to 125	-55 to 125	-55 to 125
Output Type	TTL	TTL	TTL	TTL	TTL	TTL	TTL	TTL	TTL	TTL
Package Group	LCCC	CFP	LCCC	CDIP	LCCC	CDIP	CDIP	LCCC	CDIP	CFP
Package Size: mm2:W x L, PKG	20LCCC: 79 mm2: 8.89 x 8.89(LCCC)	See datasheet (CFP)	20LCCC: 79 mm2: 8.89 x 8.89(LCCC)	See datasheet (CDIP)	20LCCC: 79 mm2: 8.89 x 8.89(LCCC)	See datasheet (CDIP)	See datasheet (CDIP)	20LCCC: 79 mm2: 8.89 x 8.89(LCCC)	See datasheet (CDIP)	See datasheet (CFP)
Rating	Military	Military	Military	Military	Military	Military	Military	Military	Military	Military
Schmitt Trigger	No	No	No	No	No	No	No	No	No	No
Technology Family	ALS	ALS	ALS	ALS	ALS	ALS	ALS	ALS	ALS	ALS
VCC(Max), V	5.5	5.5	5.5	5.5	5.5	5.5	5.5	5.5	5.5	5.5
VCC(Min), V	4.5	4.5	4.5	4.5	4.5	4.5	4.5	4.5	4.5	4.5

Öko-Plan

Anwendungshinweise

• Herunterladen
  Advanced Schottky (ALS and AS) Logic Families
  PDF, 1.9 Mb, Datei veröffentlicht: Aug 1, 1995
  This document introduces the advanced Schottky family of clamped TTL integrated circuits (ICs). Detailed electrical characteristics of the 'AS and 'ALS devices with table formats are provided. Guidelines for designing high-performance digital systems using the Advanced Schottky family are given along with a brief summary of the solutions to most design decisions needed to implement systems using t
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  Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)
  PDF, 105 Kb, Revision: A, Datei veröffentlicht: Aug 1, 1997
  The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
• Herunterladen
  Input and Output Characteristics of Digital Integrated Circuits
  PDF, 1.7 Mb, Datei veröffentlicht: Oct 1, 1996
  This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
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  TI IBIS File Creation Validation and Distribution Processes
  PDF, 380 Kb, Datei veröffentlicht: Aug 29, 2002
  The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
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  Live Insertion
  PDF, 150 Kb, Datei veröffentlicht: Oct 1, 1996
  Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
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  Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
  PDF, 614 Kb, Revision: C, Datei veröffentlicht: Dec 2, 2015
• Herunterladen
  Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
  PDF, 337 Kb, Datei veröffentlicht: Jul 8, 2004
  Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
• Herunterladen
  Designing With Logic (Rev. C)
  PDF, 186 Kb, Revision: C, Datei veröffentlicht: Jun 1, 1997
  Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
• Herunterladen
  Introduction to Logic
  PDF, 93 Kb, Datei veröffentlicht: Apr 30, 2015

Modellreihe

Herstellerklassifikation

• Semiconductors> Space & High Reliability> Logic Products> Gate Products