Datasheet Texas Instruments OMAP3515 — Datenblatt

HerstellerTexas Instruments
SerieOMAP3515
Datasheet Texas Instruments OMAP3515

Anwendungsprozessor

Datenblätter

OMAP3515 and OMAP3503 Applications Processors datasheet
PDF, 2.7 Mb, Revision: H, Datei veröffentlicht: Oct 10, 2013
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Preise

Status

OMAP3515DCBBOMAP3515DCBBAOMAP3515DCBCOMAP3515DCBCAOMAP3515DCUSOMAP3515DCUS72OMAP3515DCUSAOMAP3515ECBBOMAP3515ECBBAOMAP3515ECBCOMAP3515ECBCAOMAP3515ECUSOMAP3515ECUS72OMAP3515ECUSA
Lifecycle StatusObsolete (Manufacturer has discontinued the production of the device)Obsolete (Manufacturer has discontinued the production of the device)Obsolete (Manufacturer has discontinued the production of the device)Obsolete (Manufacturer has discontinued the production of the device)Obsolete (Manufacturer has discontinued the production of the device)Obsolete (Manufacturer has discontinued the production of the device)Obsolete (Manufacturer has discontinued the production of the device)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNoNoNoYesNoNoNoNoYesNoYesNo

Verpackung

OMAP3515DCBBOMAP3515DCBBAOMAP3515DCBCOMAP3515DCBCAOMAP3515DCUSOMAP3515DCUS72OMAP3515DCUSAOMAP3515ECBBOMAP3515ECBBAOMAP3515ECBCOMAP3515ECBCAOMAP3515ECUSOMAP3515ECUS72OMAP3515ECUSA
N1234567891011121314
Pin515515515515423423423515515515515423423423
Package TypeCBBCBBCBCCBCCUSCUSCUSCBBCBBCBCCBCCUSCUSCUS
Industry STD TermPOP-FCBGAPOP-FCBGAPOP-FCBGAPOP-FCBGAFC/CSPFC/CSPFC/CSPPOP-FCBGAPOP-FCBGAPOP-FCBGAPOP-FCBGAFC/CSPFC/CSPFC/CSP
JEDEC CodeS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-N
Device Marking3515DCBBA3515DCBCA3515DCUS3515DCUS723515DCUS3515ECBB3515ECBB3515ECBC3515ECBC3515ECUS3515ECUS72A
Width (mm)1212141416161612121414161616
Length (mm)1212141416161612121414161616
Thickness (mm).61.61.63.63.96.96.96.61.61.63.63.96.96.96
Pitch (mm).4.4.5.5.65.65.65.4.4.5.5.65.65.65
Max Height (mm).9.9.95.951.41.41.4.9.9.95.951.41.41.4
Mechanical DataHerunterladenHerunterladenHerunterladenHerunterladenHerunterladenHerunterladenHerunterladenHerunterladenHerunterladenHerunterladenHerunterladenHerunterladenHerunterladenHerunterladen
Package QTY168168119119909090
CarrierJEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)

Parameter

Parameters / ModelsOMAP3515DCBB
OMAP3515DCBB
OMAP3515DCBBA
OMAP3515DCBBA
OMAP3515DCBC
OMAP3515DCBC
OMAP3515DCBCA
OMAP3515DCBCA
OMAP3515DCUS
OMAP3515DCUS
OMAP3515DCUS72
OMAP3515DCUS72
OMAP3515DCUSA
OMAP3515DCUSA
OMAP3515ECBB
OMAP3515ECBB
OMAP3515ECBBA
OMAP3515ECBBA
OMAP3515ECBC
OMAP3515ECBC
OMAP3515ECBCA
OMAP3515ECBCA
OMAP3515ECUS
OMAP3515ECUS
OMAP3515ECUS72
OMAP3515ECUS72
OMAP3515ECUSA
OMAP3515ECUSA
ARM CPU1 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A8
ARM MHz, Max.720720720720720720720
ARM MHz (Max.)720720720720720720720
ApplicationsCommunications Equipment
Enterprise Systems
Industrial
Personal Electronics
Communications Equipment
Enterprise Systems
Industrial
Personal Electronics
Communications Equipment
Enterprise Systems
Industrial
Personal Electronics
Communications Equipment
Enterprise Systems
Industrial
Personal Electronics
Communications Equipment
Enterprise Systems
Industrial
Personal Electronics
Communications Equipment
Enterprise Systems
Industrial
Personal Electronics
Communications Equipment
Enterprise Systems
Industrial
Personal Electronics
Communications Equipment,Enterprise Systems,Industrial,Personal ElectronicsCommunications Equipment,Enterprise Systems,Industrial,Personal ElectronicsCommunications Equipment,Enterprise Systems,Industrial,Personal ElectronicsCommunications Equipment,Enterprise Systems,Industrial,Personal ElectronicsCommunications Equipment,Enterprise Systems,Industrial,Personal ElectronicsCommunications Equipment,Enterprise Systems,Industrial,Personal ElectronicsCommunications Equipment,Enterprise Systems,Industrial,Personal Electronics
Approx. Price (US$)26.52 | 1ku26.52 | 1ku26.52 | 1ku26.52 | 1ku26.52 | 1ku26.52 | 1ku26.52 | 1ku
DRAMLPDDRLPDDRLPDDRLPDDRLPDDRLPDDRLPDDRLPDDRLPDDRLPDDRLPDDRLPDDRLPDDRLPDDR
Display OptionsDSSDSSDSSDSSDSSDSSDSSDSSDSSDSSDSSDSSDSSDSS
Graphics Acceleration1 3D1 3D1 3D1 3D1 3D1 3D1 3D1 3D1 3D1 3D1 3D1 3D1 3D1 3D
I2C33333333333333
On-Chip L2 Cache256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)
Operating SystemsNeutrino
Integrity
Tornado
Windows Embedded CE
Linux
VxWorks
Neutrino
Integrity
Tornado
Windows Embedded CE
Linux
VxWorks
Neutrino
Integrity
Tornado
Windows Embedded CE
Linux
VxWorks
Neutrino
Integrity
Tornado
Windows Embedded CE
Linux
VxWorks
Neutrino
Integrity
Tornado
Windows Embedded CE
Linux
VxWorks
Neutrino
Integrity
Tornado
Windows Embedded CE
Linux
VxWorks
Neutrino
Integrity
Tornado
Windows Embedded CE
Linux
VxWorks
Integrity,Linux,Neutrino,Tornado,VxWorks,Windows Embedded CEIntegrity,Linux,Neutrino,Tornado,VxWorks,Windows Embedded CEIntegrity,Linux,Neutrino,Tornado,VxWorks,Windows Embedded CEIntegrity,Linux,Neutrino,Tornado,VxWorks,Windows Embedded CEIntegrity,Linux,Neutrino,Tornado,VxWorks,Windows Embedded CEIntegrity,Linux,Neutrino,Tornado,VxWorks,Windows Embedded CEIntegrity,Linux,Neutrino,Tornado,VxWorks,Windows Embedded CE
Operating Temperature Range, C-40 to 105,0 to 90-40 to 105,0 to 90-40 to 105,0 to 90-40 to 105,0 to 90-40 to 105,0 to 90-40 to 105,0 to 90-40 to 105,0 to 90
Operating Temperature Range(C)-40 to 105
0 to 90
-40 to 105
0 to 90
-40 to 105
0 to 90
-40 to 105
0 to 90
-40 to 105
0 to 90
-40 to 105
0 to 90
-40 to 105
0 to 90
Other On-Chip Memory64 KB64 KB64 KB64 KB64 KB64 KB64 KB64 KB64 KB64 KB64 KB64 KB64 KB64 KB
RatingCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalog
SPI44444444444444
UART, SCI3333333
UART(SCI)3333333
USB22222222222222

Öko-Plan

OMAP3515DCBBOMAP3515DCBBAOMAP3515DCBCOMAP3515DCBCAOMAP3515DCUSOMAP3515DCUS72OMAP3515DCUSAOMAP3515ECBBOMAP3515ECBBAOMAP3515ECBCOMAP3515ECBCAOMAP3515ECUSOMAP3515ECUS72OMAP3515ECUSA
RoHSNot CompliantNot CompliantNot CompliantNot CompliantNot CompliantNot CompliantNot CompliantCompliantCompliantCompliantCompliantCompliantCompliantCompliant
Pb FreeNoNoNoNoNoNoNo

Anwendungshinweise

  • Powering OMAP3 With TPS6235x: Design-In Guide
    PDF, 296 Kb, Datei veröffentlicht: Dec 3, 2008
    The OMAP35xx Applications Processors have a diverse set of power management features which potentially enable lower cost power solutions based on your application. This design-in guide describes a power solution based on the TPS6235x device. This guide can be used to evaluate this solution for your design or help you make decisions when designing in this solution.
  • OMAP35x Linux PSP Data Sheet
    PDF, 1.6 Mb, Datei veröffentlicht: Oct 16, 2009
  • OMAP35x 0.65mm Pitch Layout Methods (Rev. B)
    PDF, 372 Kb, Revision: B, Datei veröffentlicht: Jun 26, 2008
    It is easy to see from the unique look that the OMAP35x parts have a very unusual footprint. The OMAP35x ball grid array is designed with new technology called the Via Channel array which makes significant printed circuit board (PCB) cost savings possible. If the PCB is routed correctly this cost savings can be substantial. This application report explains how this is possible and shows several
  • OMAP3530/25/15/03 CBB CBC & CUS Reflow Profiles
    PDF, 27 Kb, Datei veröffentlicht: Nov 13, 2009
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute visit this topic at:

    http://wiki.davincidsp.com/index.php/OMAP3_CBB_CBC_CUS_Reflow_Profiles

    Reflow profiles are dependent on numerous factors including package type number of components bo

  • Powering OMAP3 With TPS65023: Design-In Guide (Rev. B)
    PDF, 181 Kb, Revision: B, Datei veröffentlicht: Mar 2, 2009
  • OMAP35x to AM35x Hardware Migration Guide
    PDF, 19 Kb, Datei veröffentlicht: May 24, 2010
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute visit this topic at:

    http://processors.wiki.ti.com/index.php/OMAP35x_to_AM35x_Hardware_Migration_Guide.

    This article describes hardware device considerations to migrate a design

  • OMAP35x to AM37x Hardware Migration Guide
    PDF, 37 Kb, Datei veröffentlicht: Jun 3, 2010
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute visit this topic at:

    http://processors.wiki.ti.com/index.php/OMAP35x_To_AM37x_Hardware_Migration_Guide.

    The OMAP35x to AM37x Hardware Migration Guide describes device consideratio

  • PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages Part II (Rev. A)
    PDF, 2.4 Mb, Revision: A, Datei veröffentlicht: Nov 1, 2013
    Once the bottom circuit board has been designed the assembly guidelines for package-on-package (PoP) versions of the OMAP35xx processor and the memory device must be considered.

    PoP packages have an enormous number of variables associated with assembly. The following factors have a major effect on the quality and reliability of final assembly: the circuit board design the solder paste char

  • PCB Design Guidelines for 0.4mm Package-On-Package (PoP) Packages Part I (Rev. B)
    PDF, 6.7 Mb, Revision: B, Datei veröffentlicht: Jun 13, 2009
    Ball grid array (BGA) packages having 0.4mm ball pitch require careful attention to printed circuit board (PCB) design parameters to successfully yield reliable and robust assemblies; the standard rules of thumb don't apply anymore. In fact the design guidelines for 0.4mm and 0.5mm differ primarily due to issues surrounding shorts or opens between balls under the processor.In addition to the de
  • PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors Part I
    PDF, 2.0 Mb, Datei veröffentlicht: Jun 23, 2010
    Ball grid array (BGA) packages having 0.5mm ball pitch require careful attention to printed circuit board (PCB) design parameters to successfully yield reliable and robust assemblies. PCBs with package-on-package (PoP) technology have additional assembly requirements and options that need to be considered when designing the PCB.

    Fine-pitch PCB design is a team effort and may require more than

  • PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors Part II
    PDF, 1.2 Mb, Datei veröffentlicht: Jun 23, 2010
    Once the main printed circuit board (PCB) has been designed the assembly guidelines for the 0.5mm package-on-package (PoP) applications processor and companion memory device must be considered. PoP applications processors have an enormous number of variables associated with assembly. The following factors have a major effect on the quality and reliability of PCB assembly: PoP applications process

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