Datasheet Texas Instruments MSP430F2619S-HT — Datenblatt
| Hersteller | Texas Instruments |
| Serie | MSP430F2619S-HT |
Hochtemperatur-16-Bit-MCU mit extrem geringem Stromverbrauch, 120 KB Flash, 4 KB RAM, 12-Bit-ADC, Dual-DAC, 2 USCI, HW Mult, DMA
Datenblätter
MSP430F2619S-HT Mixed-Signal Microcontroller datasheet
PDF, 1.6 Mb, Revision: E, Datei veröffentlicht: Nov 16, 2016
Auszug aus dem Dokument
Preise
Status
| MSP430F2619S64KGD1 | MSP430F2619SKGD1 | MSP430F2619SPM | |
|---|---|---|---|
| Lifecycle Status | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) |
| Manufacture's Sample Availability | No | No | No |
Verpackung
| MSP430F2619S64KGD1 | MSP430F2619SKGD1 | MSP430F2619SPM | |
|---|---|---|---|
| N | 1 | 2 | 3 |
| Package Type | KGD | KGD | PM |
| Package QTY | 36 | 36 | 160 |
| Pin | 64 | ||
| Industry STD Term | LQFP | ||
| JEDEC Code | S-PQFP-G | ||
| Carrier | JEDEC TRAY (5+1) | ||
| Device Marking | M430F2619SPM | ||
| Width (mm) | 10 | ||
| Length (mm) | 10 | ||
| Thickness (mm) | 1.4 | ||
| Pitch (mm) | .5 | ||
| Max Height (mm) | 1.6 | ||
| Mechanical Data | Herunterladen |
Parameter
| Parameters / Models | MSP430F2619S64KGD1 | MSP430F2619SKGD1 | MSP430F2619SPM |
|---|---|---|---|
| ADC | ADC12 - 8ch | ADC12 - 8ch | ADC12 - 8ch |
| AES | N/A | N/A | N/A |
| Active Power, uA/MHz | 365 | 365 | 365 |
| Additional Features | Watchdog,DAC,Temp Sensor,Brown Out Reset | Watchdog,DAC,Temp Sensor,Brown Out Reset | Watchdog,DAC,Temp Sensor,Brown Out Reset |
| BSL | UART | UART | UART |
| CPU | MSP430 | MSP430 | MSP430 |
| Comparators | Yes | Yes | Yes |
| DMA | 3 | 3 | 3 |
| Frequency, MHz | 16 | 16 | 16 |
| GPIO | 48 | 48 | 48 |
| I2C | 2 | 2 | 2 |
| Max VCC | 3.6 | 3.6 | 3.6 |
| Min VCC | 1.8 | 1.8 | 1.8 |
| Multiplier | 16x16 | 16x16 | 16x16 |
| Non-volatile Memory, KB | 120 | 120 | 120 |
| Operating Temperature Range, C | -55 to 150 | -55 to 150 | -55 to 150 |
| Package Group | LQFP | LQFP | LQFP |
| Package Size: mm2:W x L, PKG | 64LQFP: 144 mm2: 12 x 12(LQFP) | 64LQFP: 144 mm2: 12 x 12(LQFP) | 64LQFP: 144 mm2: 12 x 12(LQFP) |
| RAM, KB | 4 | 4 | 4 |
| Rating | High Temp | High Temp | High Temp |
| SPI | 4 | 4 | 4 |
| Special I/O | N/A | N/A | N/A |
| Standby Power, LPM3-uA | 0.5 | 0.5 | 0.5 |
| Timers - 16-bit | 2 | 2 | 2 |
| UART | 2 | 2 | 2 |
| Wakeup Time, us | 1 | 1 | 1 |
Öko-Plan
| MSP430F2619S64KGD1 | MSP430F2619SKGD1 | MSP430F2619SPM | |
|---|---|---|---|
| RoHS | See ti.com | See ti.com | Compliant |
Anwendungshinweise
- Migrating From MSP430 F2xx and G2xx Families to MSP430 FR4xx and FR2xx Family (Rev. E)PDF, 237 Kb, Revision: E, Datei veröffentlicht: May 4, 2018
This application report helps to ease the migration from MSP430F2xx flash-based MCUs to the MSP430FR4xx and MSP430FR2xx family of FRAM-based MCUs. It discusses programming system hardware core architecture and peripheral considerations. The intent is to highlight key differences between the two families. For more information on the use of the MSP430FR4xx and MSP430FR2xx devices see the MSP430 - General Oversampling of MSP ADCs for Higher Resolution (Rev. A)PDF, 551 Kb, Revision: A, Datei veröffentlicht: Apr 1, 2016
Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl
Modellreihe
Serie: MSP430F2619S-HT (3)
Herstellerklassifikation
- Semiconductors> Space & High Reliability> Microcontroller> Low Power MCU> MSP430 MCU