Datasheet Texas Instruments LM3102-Q1 — Datenblatt

HerstellerTexas Instruments
SerieLM3102-Q1
Datasheet Texas Instruments LM3102-Q1

SIMPLE SWITCHER® Synchroner 1-MHz-2,5-A-Abwärtsspannungsregler

Datenblätter

LM3102/-Q1 SIMPLE SWITCHERВ® Synchronous 1-MHz, 2.5-A Step-Down Voltage Regulator datasheet
PDF, 1.5 Mb, Revision: H, Datei veröffentlicht: Jun 30, 2015
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Preise

Status

LM3102QMH/NOPBLM3102QMHX/NOPB
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityYesNo

Verpackung

LM3102QMH/NOPBLM3102QMHX/NOPB
N12
Pin2020
Package TypePWPPWP
Industry STD TermHTSSOPHTSSOP
JEDEC CodeR-PDSO-GR-PDSO-G
Package QTY732500
CarrierTUBELARGE T&R
Device MarkingQMHQMH
Width (mm)4.44.4
Length (mm)6.56.5
Thickness (mm)11
Pitch (mm).65.65
Max Height (mm)1.21.2
Mechanical DataHerunterladenHerunterladen

Parameter

Parameters / ModelsLM3102QMH/NOPB
LM3102QMH/NOPB
LM3102QMHX/NOPB
LM3102QMHX/NOPB
Control ModeCOT with emulated rippleCOT with emulated ripple
Duty Cycle(Max), %9494
Iout(Max), A2.52.5
Iq(Typ), mA11
Operating Temperature Range, C-40 to 125-40 to 125
Package GroupHTSSOPHTSSOP
RatingAutomotiveAutomotive
Regulated Outputs11
Special FeaturesEnable,Synchronous RectificationEnable,Synchronous Rectification
Switching Frequency(Max), kHz10001000
Switching Frequency(Min), kHz200200
TypeConverterConverter
Vin(Max), V4242
Vin(Min), V4.54.5
Vout(Max), V77
Vout(Min), V0.80.8

Öko-Plan

LM3102QMH/NOPBLM3102QMHX/NOPB
RoHSCompliantCompliant

Anwendungshinweise

  • AN-643 EMI/RFI Board Design (Rev. B)
    PDF, 742 Kb, Revision: B, Datei veröffentlicht: May 3, 2004
    Application Note 643 EMI/RFI Board Design
  • Input and Output Capacitor Selection
    PDF, 219 Kb, Datei veröffentlicht: Sep 19, 2005
  • AN-1197 Selecting Inductors for Buck Converters (Rev. B)
    PDF, 558 Kb, Revision: B, Datei veröffentlicht: Apr 23, 2013
    This application report provides design information to help select an off-the-shelf inductor for anycontinuous-mode buck converter application.
  • AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)
    PDF, 3.6 Mb, Revision: A, Datei veröffentlicht: Apr 23, 2013
    This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
  • AN-1566 Techniques for Thermal Analysis of Switching Power Supply Designs (Rev. A)
    PDF, 1.4 Mb, Revision: A, Datei veröffentlicht: Apr 23, 2013
    This application note provides thermal power analysis techniques for analyzing the power IC.
  • AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A)
    PDF, 2.7 Mb, Revision: A, Datei veröffentlicht: Apr 23, 2013
    This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time.
  • Semiconductor and IC Package Thermal Metrics (Rev. C)
    PDF, 201 Kb, Revision: C, Datei veröffentlicht: Apr 19, 2016
  • AN-2218 Precision Current Limiting with the LMP8646 and LM3102 (Rev. A)
    PDF, 109 Kb, Revision: A, Datei veröffentlicht: Apr 23, 2013
    This application report discusses how to design the Texas Instruments LMP8646 with the LM3102 voltageregulator and a supercap load application.
  • Low EMI Layout Made SIMPLE With LM43600/1/2/3 and LM46000/1/2 (Rev. A)
    PDF, 512 Kb, Revision: A, Datei veröffentlicht: Sep 12, 2014
    Printed Circuit Board (PCB) layout for Switched Mode Power Supplies (SMPS) is critical to achieve proper converter operation good thermal performance and excellent radiated EMI performance. Optimized board layout for low radiated EMI is made very simple by the package and pin arrangement of the SIMPLE SWITCHER Synchronous Buck Converter family LM4360x and LM4600x
  • AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)
    PDF, 82 Kb, Revision: C, Datei veröffentlicht: Apr 23, 2013
    When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current
  • AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)
    PDF, 374 Kb, Revision: C, Datei veröffentlicht: Apr 23, 2013
    This application report provides SIMPLE SWITCHER™ PCB layout guidelines.
  • AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)
    PDF, 2.5 Mb, Revision: C, Datei veröffentlicht: Apr 24, 2013
    Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti
  • AN-2200 Precision Current Limiting with the LMP8646 and LMZ12003 (Rev. A)
    PDF, 94 Kb, Revision: A, Datei veröffentlicht: Apr 23, 2013
    This application report discusses how to design the Texas Instruments LMP8646 with the LMZ12003voltage regulator and a resistive load application.
  • AN-1246 Stresses in Wide Input DC-DC Converters (Rev. C)
    PDF, 427 Kb, Revision: C, Datei veröffentlicht: Apr 23, 2013
    This application note discusses stresses in wide input DC-DC converters.
  • AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)
    PDF, 9.2 Mb, Revision: B, Datei veröffentlicht: Apr 23, 2013
    This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP

Modellreihe

Serie: LM3102-Q1 (2)

Herstellerklassifikation

  • Semiconductors> Power Management> Non-isolated DC/DC Switching Regulator> Step-Down (Buck)> Buck Converter (Integrated Switch)