Datasheet Texas Instruments LM2586 — Datenblatt

HerstellerTexas Instruments
SerieLM2586
Datasheet Texas Instruments LM2586

EINFACHER SCHALTER 4V bis 40V, 3A Step-Up Wide Vin Flyback Regulator

Datenblätter

LM2586 SIMPLE SWITCHER 3A Flyback Regulator with Shutdown datasheet
PDF, 2.1 Mb, Revision: D, Datei veröffentlicht: Apr 3, 2013
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Preise

Status

LM2586S-12/NOPBLM2586S-3.3/NOPBLM2586S-5.0/NOPBLM2586S-ADJLM2586S-ADJ/NOPBLM2586SX-3.3/NOPBLM2586SX-5.0/NOPBLM2586SX-ADJLM2586SX-ADJ/NOPBLM2586T-3.3/NOPBLM2586T-5.0/NOPBLM2586T-ADJLM2586T-ADJ/NOPB
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)NRND (Not recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)NRND (Not recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)NRND (Not recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityYesNoYesYesNoNoYesYesNoYesNoYesYes

Verpackung

LM2586S-12/NOPBLM2586S-3.3/NOPBLM2586S-5.0/NOPBLM2586S-ADJLM2586S-ADJ/NOPBLM2586SX-3.3/NOPBLM2586SX-5.0/NOPBLM2586SX-ADJLM2586SX-ADJ/NOPBLM2586T-3.3/NOPBLM2586T-5.0/NOPBLM2586T-ADJLM2586T-ADJ/NOPB
N12345678910111213
Pin7777777777777
Package TypeKTWKTWKTWKTWKTWKTWKTWKTWKTWNDZNDZNDZNDZ
Industry STD TermTO-263TO-263TO-263TO-263TO-263TO-263TO-263TO-263TO-263TO-220TO-220TO-220TO-220
JEDEC CodeR-PSFM-GR-PSFM-GR-PSFM-GR-PSFM-GR-PSFM-GR-PSFM-GR-PSFM-GR-PSFM-GR-PSFM-GR-MSFM-LR-MSFM-LR-MSFM-LR-MSFM-L
Package QTY454545454550050050045454545
CarrierTUBETUBETUBETUBETUBELARGE T&RLARGE T&RLARGE T&RLARGE T&RTUBETUBETUBETUBE
Device MarkingLM2586S-3.3 P+-5.0 P+-ADJ P+-ADJ P+LM2586S-5.0 P+LM2586S-ADJ P+-3.3 P+-5.0 P+-ADJ P+LM2586T
Width (mm)8.898.898.898.898.898.898.898.898.8910.1610.1610.1610.16
Length (mm)10.110.110.110.110.110.110.110.110.114.98614.98614.98614.986
Thickness (mm)4.444.444.444.444.444.444.444.444.444.5724.5724.5724.572
Pitch (mm)1.271.271.271.271.271.271.271.271.271.271.271.271.27
Max Height (mm)4.654.654.654.654.654.654.654.654.654.74.74.74.7
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Parameter

Parameters / ModelsLM2586S-12/NOPB
LM2586S-12/NOPB
LM2586S-3.3/NOPB
LM2586S-3.3/NOPB
LM2586S-5.0/NOPB
LM2586S-5.0/NOPB
LM2586S-ADJ
LM2586S-ADJ
LM2586S-ADJ/NOPB
LM2586S-ADJ/NOPB
LM2586SX-3.3/NOPB
LM2586SX-3.3/NOPB
LM2586SX-5.0/NOPB
LM2586SX-5.0/NOPB
LM2586SX-ADJ
LM2586SX-ADJ
LM2586SX-ADJ/NOPB
LM2586SX-ADJ/NOPB
LM2586T-3.3/NOPB
LM2586T-3.3/NOPB
LM2586T-5.0/NOPB
LM2586T-5.0/NOPB
LM2586T-ADJ
LM2586T-ADJ
LM2586T-ADJ/NOPB
LM2586T-ADJ/NOPB
Duty Cycle(Max), %98989898989898989898989898
Iq(Typ), mA11111111111111111111111111
Operating Temperature Range, C-40 to 125-40 to 125-40 to 125-40 to 125-40 to 125-40 to 125-40 to 125-40 to 125-40 to 125-40 to 125-40 to 125-40 to 125-40 to 125
Package GroupDDPAK/TO-263DDPAK/TO-263DDPAK/TO-263DDPAK/TO-263DDPAK/TO-263DDPAK/TO-263DDPAK/TO-263DDPAK/TO-263DDPAK/TO-263TO-220TO-220TO-220TO-220
RatingCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalog
Regulated Outputs1111111111111
Special FeaturesEnable,Frequency SynchronizationEnable,Frequency SynchronizationEnable,Frequency SynchronizationEnable,Frequency SynchronizationEnable,Frequency SynchronizationEnable,Frequency SynchronizationEnable,Frequency SynchronizationEnable,Frequency SynchronizationEnable,Frequency SynchronizationEnable,Frequency SynchronizationEnable,Frequency SynchronizationEnable,Frequency SynchronizationEnable,Frequency Synchronization
Switch Current Limit(Min), A3333333333333
Switch Current Limit(Typ), A4444444444444
Switching Frequency(Max), kHz125125125125125125125125125125125125125
Switching Frequency(Min), kHz75757575757575757575757575
TypeConverterConverterConverterConverterConverterConverterConverterConverterConverterConverterConverterConverterConverter
Vin(Max), V40404040404040404040404040
Vin(Min), V4444444444444
Vout(Max), V60606060606060606060606060
Vout(Min), V1.231.231.231.231.231.231.231.231.231.231.231.231.23

Öko-Plan

LM2586S-12/NOPBLM2586S-3.3/NOPBLM2586S-5.0/NOPBLM2586S-ADJLM2586S-ADJ/NOPBLM2586SX-3.3/NOPBLM2586SX-5.0/NOPBLM2586SX-ADJLM2586SX-ADJ/NOPBLM2586T-3.3/NOPBLM2586T-5.0/NOPBLM2586T-ADJLM2586T-ADJ/NOPB
RoHSCompliantCompliantCompliantSee ti.comCompliantCompliantCompliantNot CompliantCompliantCompliantCompliantSee ti.comCompliant
Pb FreeYesYesYesYesYesYesYesYesYesYes

Anwendungshinweise

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    In many systems backup power is provided either by batteries or simply by a large value capacitor. Inthese applications the capacitor would only provide the current when the primary power source fails.Further, these applications are usually for light load currents. During normal operation the backupcapacitors are kept charged up by a DC/DC converter. The challenge involved in an application
  • AN-643 EMI/RFI Board Design (Rev. B)
    PDF, 742 Kb, Revision: B, Datei veröffentlicht: May 3, 2004
    Application Note 643 EMI/RFI Board Design
  • Working With Boost Converters
    PDF, 159 Kb, Datei veröffentlicht: Jun 15, 2015
    This brief note highlights some of the more common pitfalls when using boost regulators. These includemaximum achievable output current and voltage, short circuit behavior and basic layout issues. It isassumed that the reader is familiar with the basic operation of a boost regulator.
  • Input and Output Capacitor Selection
    PDF, 219 Kb, Datei veröffentlicht: Sep 19, 2005
  • Basic Calculation of a Boost Converter's Power Stage (Rev. C)
    PDF, 186 Kb, Revision: C, Datei veröffentlicht: Jan 8, 2014
    This application note gives the equations to calculate the power stage of a boost converter built with an IC with integrated switch and operating in continuous conduction mode. It is not intended to give details on the functionality of a boost converter (see Reference 1) or how to compensate a converter. See the references at the end of this document if more detail is needed.
  • AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)
    PDF, 3.6 Mb, Revision: A, Datei veröffentlicht: Apr 23, 2013
    This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
  • AN-1566 Techniques for Thermal Analysis of Switching Power Supply Designs (Rev. A)
    PDF, 1.4 Mb, Revision: A, Datei veröffentlicht: Apr 23, 2013
    This application note provides thermal power analysis techniques for analyzing the power IC.
  • AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A)
    PDF, 2.7 Mb, Revision: A, Datei veröffentlicht: Apr 23, 2013
    This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time.
  • Semiconductor and IC Package Thermal Metrics (Rev. C)
    PDF, 201 Kb, Revision: C, Datei veröffentlicht: Apr 19, 2016
  • Inverted SEPIC Made SIMPLE
    PDF, 408 Kb, Datei veröffentlicht: Jul 31, 2015
    There can be quite a few applications that require a conversion from a negative input voltage to a negativeoutput voltage and there are a few ways to go about doing it. The telecom industry is one such examplewhere the rails are usually negative. This design space along with being limited is not well explored. In thisapplication note we will go over the use of an integrated boost regulator i
  • Simple Techniques Minimize Cross-Coupling in Distributed Power Systems
    PDF, 335 Kb, Datei veröffentlicht: Mar 21, 2007
  • AN-1082 Adjust or Synchronize LM2586/88 Switching Frequency (Rev. B)
    PDF, 69 Kb, Revision: B, Datei veröffentlicht: Apr 23, 2013
    Switching frequency is a very important parameter in switching power converters. As the switchingfrequency increases, the physical size of magnetic elements and other components in the circuit reducesignificantly. Switching frequency also plays a great role in control loop gain and compensation design.Switching frequency determines the maximum allowable bandwidth of the control loop. Switchi
  • AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)
    PDF, 82 Kb, Revision: C, Datei veröffentlicht: Apr 23, 2013
    When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current
  • Understanding Boost Power Stages In Switchmode Power Supplies
    PDF, 149 Kb, Datei veröffentlicht: Mar 4, 1999
    A switching power supply consists of the power stage and the control circuit. The power stage performs the basic power conversion from the input voltage to the output voltage and includes switches and the output filter. This report addresses the boost power stage only and does not cover control circuits. The report includes detailed steady-stage and small-signal analysis of the boost power stage o
  • AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)
    PDF, 374 Kb, Revision: C, Datei veröffentlicht: Apr 23, 2013
    This application report provides SIMPLE SWITCHER™ PCB layout guidelines.
  • AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)
    PDF, 2.5 Mb, Revision: C, Datei veröffentlicht: Apr 24, 2013
    Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti
  • AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)
    PDF, 9.2 Mb, Revision: B, Datei veröffentlicht: Apr 23, 2013
    This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP

Modellreihe

Herstellerklassifikation

  • Semiconductors> Power Management> Non-isolated DC/DC Switching Regulator> Step-Up (Boost)> Boost Converter (Integrated Switch)