Datasheet Texas Instruments ISO7330-Q1 — Datenblatt

HerstellerTexas Instruments
SerieISO7330-Q1

Automotive, Low Power, Dreikanal-3/0-Digitalisolator

Datenblätter

ISO733x-Q1 Robust EMC, Low Power, Triple-Channel Digital Isolators datasheet
PDF, 1.3 Mb, Datei veröffentlicht: Nov 16, 2015
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Preise

Status

ISO7330CQDWQ1ISO7330CQDWRQ1ISO7330FCQDWQ1ISO7330FCQDWRQ1
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityYesYesNoNo

Verpackung

ISO7330CQDWQ1ISO7330CQDWRQ1ISO7330FCQDWQ1ISO7330FCQDWRQ1
N1234
Pin16161616
Package TypeDWDWDWDW
Industry STD TermSOICSOICSOICSOIC
JEDEC CodeR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-G
Package QTY402000402000
CarrierTUBELARGE T&RTUBELARGE T&R
Device MarkingISO7330CQISO7330CQISO7330FCQISO7330FCQ
Width (mm)7.57.57.57.5
Length (mm)10.310.310.310.3
Thickness (mm)2.352.352.352.35
Pitch (mm)1.271.271.271.27
Max Height (mm)2.652.652.652.65
Mechanical DataHerunterladenHerunterladenHerunterladenHerunterladen

Parameter

Parameters / ModelsISO7330CQDWQ1ISO7330CQDWRQ1ISO7330FCQDWQ1ISO7330FCQDWRQ1
Data Rate(Max), Mbps25252525
Default OutputHighHighLowLow
Forward/Reverse Channels3/03/03/03/0
Integrated Isolated PowerNoNoNoNo
Isolation Rating, Vrms3000300030003000
Number of Channels3333
Operating Temperature Range, C-40 to 125-40 to 125-40 to 125-40 to 125
Package GroupSOICSOICSOICSOIC
Package Size: mm2:W x L, PKG16SOIC: 106 mm2: 10.3 x 10.3(SOIC)16SOIC: 106 mm2: 10.3 x 10.3(SOIC)16SOIC: 106 mm2: 10.3 x 10.3(SOIC)16SOIC: 106 mm2: 10.3 x 10.3(SOIC)
Propagation Delay, ns31313131
Propagation Delay(Typ), ns31313131
RatingAutomotiveAutomotiveAutomotiveAutomotive
Surge Voltage Rating, Vpk6000600060006000
VCC(Max), V5555
VCC(Min), V3.33.33.33.3

Öko-Plan

ISO7330CQDWQ1ISO7330CQDWRQ1ISO7330FCQDWQ1ISO7330FCQDWRQ1
RoHSCompliantCompliantCompliantCompliant

Anwendungshinweise

  • Shelf-Life Evaluation of Lead-Free Component Finishes
    PDF, 1.3 Mb, Datei veröffentlicht: May 24, 2004
    The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time that components can be stored prior to being soldered. This study predicts shelf life of the primary Pb-free finishes being proposed by the industry. Components were exposed to a controlled environment, with known aging a

Modellreihe

Herstellerklassifikation

  • Semiconductors> Isolation> Digital Isolators