Datasheet Texas Instruments ISO7321-Q1 — Datenblatt

HerstellerTexas Instruments
SerieISO7321-Q1

Zweikanaliger 1/1 Digitalisolator für Kraftfahrzeuge mit geringem Stromverbrauch

Datenblätter

ISO732x-Q1 Robust EMC, Low Power, Dual-Channel Digital Isolators datasheet
PDF, 1.3 Mb, Datei veröffentlicht: Nov 16, 2015
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Preise

Status

ISO7321CQDQ1ISO7321CQDRQ1ISO7321FCQDQ1ISO7321FCQDRQ1
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoYesYesNo

Verpackung

ISO7321CQDQ1ISO7321CQDRQ1ISO7321FCQDQ1ISO7321FCQDRQ1
N1234
Pin8888
Package TypeDDDD
Industry STD TermSOICSOICSOICSOIC
JEDEC CodeR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-G
Package QTY752500752500
CarrierTUBELARGE T&RTUBELARGE T&R
Device Marking7321Q7321Q7321FQ7321FQ
Width (mm)3.913.913.913.91
Length (mm)4.94.94.94.9
Thickness (mm)1.581.581.581.58
Pitch (mm)1.271.271.271.27
Max Height (mm)1.751.751.751.75
Mechanical DataHerunterladenHerunterladenHerunterladenHerunterladen

Parameter

Parameters / ModelsISO7321CQDQ1ISO7321CQDRQ1ISO7321FCQDQ1ISO7321FCQDRQ1
Data Rate(Max), Mbps25252525
Default OutputHighHighLowLow
Forward/Reverse Channels1/11/11/11/1
Integrated Isolated PowerNoNoNoNo
Isolation Rating, Vrms3000300030003000
Number of Channels2222
Operating Temperature Range, C-40 to 125-40 to 125-40 to 125-40 to 125
Package GroupSOICSOICSOICSOIC
Package Size: mm2:W x L, PKG8SOIC: 29 mm2: 6 x 4.9(SOIC)8SOIC: 29 mm2: 6 x 4.9(SOIC)8SOIC: 29 mm2: 6 x 4.9(SOIC)8SOIC: 29 mm2: 6 x 4.9(SOIC)
Propagation Delay, ns31313131
Propagation Delay(Typ), ns31313131
RatingAutomotiveAutomotiveAutomotiveAutomotive
Surge Voltage Rating, Vpk6000600060006000
VCC(Max), V5555
VCC(Min), V3.33.33.33.3

Öko-Plan

ISO7321CQDQ1ISO7321CQDRQ1ISO7321FCQDQ1ISO7321FCQDRQ1
RoHSCompliantCompliantCompliantCompliant

Anwendungshinweise

  • Shelf-Life Evaluation of Lead-Free Component Finishes
    PDF, 1.3 Mb, Datei veröffentlicht: May 24, 2004
    The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time that components can be stored prior to being soldered. This study predicts shelf life of the primary Pb-free finishes being proposed by the industry. Components were exposed to a controlled environment, with known aging a

Modellreihe

Herstellerklassifikation

  • Semiconductors> Isolation> Digital Isolators