Datasheet Texas Instruments CY54FCT543T — Datenblatt

HerstellerTexas Instruments
SerieCY54FCT543T
Datasheet Texas Instruments CY54FCT543T

Oktal registrierte Transceiver mit 3-Zustands-Ausgängen

Datenblätter

8-Bit Latched Registered Transceivers With 3-State Outputs datasheet
PDF, 684 Kb, Revision: A, Datei veröffentlicht: Oct 1, 2001
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Preise

Status

5962-9222101M3A5962-9222101MLACY54FCT543TDMBCY54FCT543TLMB
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNoNo

Verpackung

5962-9222101M3A5962-9222101MLACY54FCT543TDMBCY54FCT543TLMB
N1234
Pin28242428
Package TypeFKJTJTFK
Industry STD TermLCCCCDIPCDIPLCCC
JEDEC CodeS-CQCC-NR-GDIP-TR-GDIP-TS-CQCC-N
Package QTY1111
CarrierTUBETUBETUBETUBE
Width (mm)11.436.926.9211.43
Length (mm)11.43323211.43
Thickness (mm)1.834.74.71.83
Pitch (mm)1.272.542.541.27
Max Height (mm)2.035.085.082.03
Mechanical DataHerunterladenHerunterladenHerunterladenHerunterladen
Device MarkingCY54FCT543TDMB5962-

Parameter

Parameters / Models5962-9222101M3A
5962-9222101M3A
5962-9222101MLA
5962-9222101MLA
CY54FCT543TDMB
CY54FCT543TDMB
CY54FCT543TLMB
CY54FCT543TLMB
Bits8888
Operating Temperature Range, C-55 to 125-55 to 125-55 to 125-55 to 125
Package GroupLCCCCDIPCDIPLCCC
Package Size: mm2:W x L, PKG28LCCC: 131 mm2: 11.43 x 11.43(LCCC)See datasheet (CDIP)See datasheet (CDIP)28LCCC: 131 mm2: 11.43 x 11.43(LCCC)
RatingMilitaryMilitaryMilitaryMilitary
Schmitt TriggerNoNoNoNo
Technology FamilyFCTFCTFCTFCT
VCC(Max), V5.255.255.255.25
VCC(Min), V4.754.754.754.75

Öko-Plan

5962-9222101M3A5962-9222101MLACY54FCT543TDMBCY54FCT543TLMB
RoHSSee ti.comSee ti.comSee ti.comSee ti.com

Anwendungshinweise

  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, Revision: C, Datei veröffentlicht: Dec 2, 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, Datei veröffentlicht: Jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Selecting the Right Level Translation Solution (Rev. A)
    PDF, 313 Kb, Revision: A, Datei veröffentlicht: Jun 22, 2004
    Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati
  • Introduction to Logic
    PDF, 93 Kb, Datei veröffentlicht: Apr 30, 2015

Modellreihe

Herstellerklassifikation

  • Semiconductors> Space & High Reliability> Logic Products> Buffers/Drivers/Transceivers> Transceivers