Datasheet Texas Instruments CD4508BD3 — Datenblatt

Data sheet acquired from Harris Semiconductor
SCHS070B – Revised June 2003 The CD4508B types are supplied in 24-lead
hermetic dual-in-line ceramic packages (F3A
suffix), 24-lead dual-in-line plastic packages (E
suffix), 24-lead small-outline packages (M, M96,
and NSR suffixes), and 24-lead thin shrink
small-outline packages (PW and PWR suffixes).
The CD4508B is similar to industry type
MC14508. Copyright пЈ© 2003, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2015 PACKAGING INFORMATION
Orderable Device Status
(1) Package Type Package Pins Package
Drawing
Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (В°C) Device Marking
(4/5) CD4508BD3 ACTIVE CDIP SB JD 24 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 CD4508BD/3 CD4508BF3A ACTIVE CDIP J 24 1 TBD Call TI N / A for Pkg Type -55 to 125 CD4508BF3A CD4508BM ACTIVE SOIC DW 24 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4508BM CD4508BM96 ACTIVE SOIC DW 24 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4508BM CD4508BME4 ACTIVE SOIC DW 24 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4508BM CD4508BNSR ACTIVE SO NS 24 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4508B CD4508BPW ACTIVE TSSOP PW 24 60 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM508B (1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available. …