Datasheet Texas Instruments CD4016B-MIL — Datenblatt

HerstellerTexas Instruments
SerieCD4016B-MIL
Datasheet Texas Instruments CD4016B-MIL

CMOS Quad Bilateral Switch

Datenblätter

CD4016B TYPES datasheet
PDF, 1.3 Mb, Revision: C, Datei veröffentlicht: Aug 21, 2003
Auszug aus dem Dokument

Preise

Status

5962-9064001CACD4016BFCD4016BF3A
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNo

Verpackung

5962-9064001CACD4016BFCD4016BF3A
N123
Pin141414
Package TypeJJJ
Industry STD TermCDIPCDIPCDIP
JEDEC CodeR-GDIP-TR-GDIP-TR-GDIP-T
Package QTY111
CarrierTUBETUBETUBE
Width (mm)6.676.676.67
Length (mm)19.5619.5619.56
Thickness (mm)4.574.574.57
Pitch (mm)2.542.542.54
Max Height (mm)5.085.085.08
Mechanical DataHerunterladenHerunterladenHerunterladen
Device MarkingCD4016BFCD4016BF3A

Parameter

Parameters / Models5962-9064001CA
5962-9064001CA
CD4016BF
CD4016BF
CD4016BF3A
CD4016BF3A
Number of Channels444
Operating Temperature Range, C-55 to 125-55 to 125-55 to 125
Package GroupCDIPCDIPCDIP
Package Size: mm2:W x L, PKGSee datasheet (CDIP)See datasheet (CDIP)See datasheet (CDIP)
RatingMilitaryMilitaryMilitary
Ron(Max), Ohms400400400
Ron(Typ), Ohms280280280
Technology FamilyCD4000CD4000CD4000
VCC(Max), V181818
VCC(Min), V333

Öko-Plan

5962-9064001CACD4016BFCD4016BF3A
RoHSSee ti.comSee ti.comSee ti.com

Anwendungshinweise

  • Understanding Buffered and Unbuffered CD4xxxB Series Device Characteristics
    PDF, 188 Kb, Datei veröffentlicht: Dec 3, 2001
    Both buffered and unbuffered CMOS B-series gates inverters and high-current IC products are available from TI. Each product classification has application advantages in appropriate logic-system designs. Many CMOS suppliers have concentrated on promoting buffered B-series products with applications literature focusing on the attributes and use of the buffered types. This practice has left an imb
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, Revision: C, Datei veröffentlicht: Dec 2, 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, Datei veröffentlicht: Jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge

Modellreihe

Serie: CD4016B-MIL (3)

Herstellerklassifikation

  • Semiconductors> Space & High Reliability> Logic Products> Switches and Multiplexer> Signal Switch