Datasheet Texas Instruments AM3703CBPD100 — Datenblatt

HerstellerTexas Instruments
SerieAM3703
ArtikelnummerAM3703CBPD100
Datasheet Texas Instruments AM3703CBPD100

Sitara-Prozessor: ARM Cortex-A8, LPDDR 515-POP-FCBGA -40 bis 90

Datenblätter

AM3715, AM3703 Sitara ARM Microprocessors datasheet
PDF, 3.2 Mb, Revision: F, Datei veröffentlicht: Aug 29, 2011
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Preise

Status

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityYes

Verpackung

Pin515515
Package TypeCBPCBP
Industry STD TermPOP-FCBGAPOP-FCBGA
JEDEC CodeS-PBGA-NS-PBGA-N
Package QTY168168
CarrierJEDEC TRAY (5+1)JEDEC TRAY (5+1)
Device MarkingAM3703CBPD100-AS3AM3703CBPD100
Width (mm)1212
Length (mm)1212
Thickness (mm).5.5
Pitch (mm).4.4
Max Height (mm).7.7
Mechanical DataHerunterladenHerunterladen

Parameter

ARM CPU1 ARM Cortex-A8
ARM MHz1000 Max.
ApplicationsIndustrial,Personal Electronics
DRAMLPDDR
Display OptionsDSS
Graphics AccelerationN/A
I2C4
On-Chip L2 Cache256 KB (ARM Cortex-A8)
Operating SystemsAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE
Operating Temperature Range-40 to 105,-40 to 90,0 to 90 C
Other On-Chip Memory64 KB
RatingCatalog
SPI4
UART4 SCI
USB4
Video Port1 Input,1 Output Configurable

Öko-Plan

RoHSCompliant

Design Kits und Evaluierungsmodule

  • JTAG Emulators/ Analyzers: TMDSEMU560V2STM-UE
    XDS560v2 System Trace USB & Ethernet Debug Probe
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: TMDSEMU560V2STM-U
    XDS560v2 System Trace USB Debug Probe
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: TMDSEVM3730
    AM/DM37x Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: TMDSEMU200-U
    XDS200 USB Debug Probe
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: BEAGLEXM
    BeagleBoard-xM Development Board
    Lifecycle Status: Obsolete (Manufacturer has discontinued the production of the device)

Anwendungshinweise

  • AM3715/03 SDRC Subsystem
    PDF, 19 Kb, Datei veröffentlicht: Jun 3, 2010
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM3715/03_SDRC_SubsystemThe SDRC subsystem module provides connectivity between the AM37x and SDRAM memory components. The module incl
  • AM/DM37x Power Estimation Spreadsheet
    PDF, 20 Kb, Datei veröffentlicht: Jun 7, 2010
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or tocontribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM/DM37x_Power_Estimation_SpreadsheetThis article discusses the power consumption of the Texas Instruments AM/DM37x high
  • AM/DM37x Overview
    PDF, 19 Kb, Datei veröffentlicht: Jun 3, 2010
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM/DM37x_Overview.This document provides an overview of the AM37x applications processor.All trademarks are property of their respective
  • AM3715/03 Memory Subsystem
    PDF, 19 Kb, Datei veröffentlicht: Jun 3, 2010
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM3715/03_Memory_SubsystemThe Memory Subsystem in the AM3715/03 devices consists of the internal SRAM and two dedicated memory contr
  • AM37x/DM37x Schematic Checklist
    PDF, 19 Kb, Datei veröffentlicht: Jun 3, 2010
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM37x/DM37x_Schematic_Checklist.This article provides many tips related to reset, JTAG, peripherals, etc. It should be used as
  • AM37x EVM Software Developer's Guide
    PDF, 19 Kb, Datei veröffentlicht: Jun 3, 2010
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM37x_EVM_Software_Developer%27s_Guide.This wiki article illustrates the various software components provided with the A
  • PCB Design Req for Dist. Network for TI OMAP3630, AM37xx, and DM37xx MCUs
    PDF, 739 Kb, Datei veröffentlicht: Jun 15, 2011
    The purpose of a power distribution network (PDN) is to provide clean and reliable power to active devices in the system. The printed circuit board (PCB) is a critical component of the system-level PDN. Therefore, the PCB design is of utmost importance for high-performance low-power microprocessors. This application report provides design requirements and details a step-by-step methodology on how
  • Ethernet Connectivity via GPMC
    PDF, 19 Kb, Datei veröffentlicht: Jun 3, 2010
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/Ethernet_Connectivity_via_GPMCThe purpose of this article is to describe a solution for connecting Ethernet to various devices,
  • Setting up AM37x SDRC Registers
    PDF, 19 Kb, Datei veröffentlicht: Jun 3, 2010
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/Setting_up_AM37x_SDRC_registersThis wiki article describes how to set the SDRC registers in the OMAP35x SDRC module depending o
  • AM37x CUS Routing Guidelines
    PDF, 19 Kb, Datei veröffentlicht: Jun 3, 2010
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM37x_CUS_Routing_Guidelines.CUS package is designed with a new technology called Via Channelв„ў array. This technology allows for e
  • OMAP35x to AM37x Hardware Migration Guide
    PDF, 37 Kb, Datei veröffentlicht: Jun 3, 2010
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute visit this topic at:

    http://processors.wiki.ti.com/index.php/OMAP35x_To_AM37x_Hardware_Migration_Guide.

    The OMAP35x to AM37x Hardware Migration Guide describes device consideratio

  • PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages Part II (Rev. A)
    PDF, 2.4 Mb, Revision: A, Datei veröffentlicht: Nov 1, 2013
    Once the bottom circuit board has been designed the assembly guidelines for package-on-package (PoP) versions of the OMAP35xx processor and the memory device must be considered.

    PoP packages have an enormous number of variables associated with assembly. The following factors have a major effect on the quality and reliability of final assembly: the circuit board design the solder paste char

  • PCB Design Guidelines for 0.4mm Package-On-Package (PoP) Packages Part I (Rev. B)
    PDF, 6.7 Mb, Revision: B, Datei veröffentlicht: Jun 13, 2009
    Ball grid array (BGA) packages having 0.4mm ball pitch require careful attention to printed circuit board (PCB) design parameters to successfully yield reliable and robust assemblies; the standard rules of thumb don't apply anymore. In fact the design guidelines for 0.4mm and 0.5mm differ primarily due to issues surrounding shorts or opens between balls under the processor.In addition to the de
  • PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors Part I
    PDF, 2.0 Mb, Datei veröffentlicht: Jun 23, 2010
    Ball grid array (BGA) packages having 0.5mm ball pitch require careful attention to printed circuit board (PCB) design parameters to successfully yield reliable and robust assemblies. PCBs with package-on-package (PoP) technology have additional assembly requirements and options that need to be considered when designing the PCB.

    Fine-pitch PCB design is a team effort and may require more than

  • PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors Part II
    PDF, 1.2 Mb, Datei veröffentlicht: Jun 23, 2010
    Once the main printed circuit board (PCB) has been designed the assembly guidelines for the 0.5mm package-on-package (PoP) applications processor and companion memory device must be considered. PoP applications processors have an enormous number of variables associated with assembly. The following factors have a major effect on the quality and reliability of PCB assembly: PoP applications process

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  • Semiconductors > Processors > Sitara Processors > ARM Cortex-A8 > AM3x