Datasheet Texas Instruments AM26LS33A — Datenblatt

Hersteller	Texas Instruments
Serie	AM26LS33A

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Datenblätter

PDF, 1.4 Mb, Revision: F, Datei veröffentlicht: Sep 19, 2016

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	AM26LS33ACD	AM26LS33ACDG4	AM26LS33ACDR	AM26LS33ACDRE4	AM26LS33ACDRG4	AM26LS33ACN	AM26LS33ACNE4
Lifecycle Status	Active (Recommended for new designs)	Active (Recommended for new designs)	Active (Recommended for new designs)	Active (Recommended for new designs)	Active (Recommended for new designs)	Active (Recommended for new designs)	Active (Recommended for new designs)
Manufacture's Sample Availability	No	No	No	No	No	No	No

	AM26LS33ACD	AM26LS33ACDG4	AM26LS33ACDR	AM26LS33ACDRE4	AM26LS33ACDRG4	AM26LS33ACN	AM26LS33ACNE4
N	1	2	3	4	5	6	7
Pin	16	16	16	16	16	16	16
Package Type	D	D	D	D	D	N	N
Industry STD Term	SOIC	SOIC	SOIC	SOIC	SOIC	PDIP	PDIP
JEDEC Code	R-PDSO-G	R-PDSO-G	R-PDSO-G	R-PDSO-G	R-PDSO-G	R-PDIP-T	R-PDIP-T
Package QTY	40	40	2500	2500	2500	25	25
Carrier	TUBE	TUBE	LARGE T&R	LARGE T&R	LARGE T&R	TUBE	TUBE
Device Marking	26LS33AC	26LS33AC	26LS33AC	26LS33AC	26LS33AC	AM26LS33ACN	AM26LS33ACN
Width (mm)	3.91	3.91	3.91	3.91	3.91	6.35	6.35
Length (mm)	9.9	9.9	9.9	9.9	9.9	19.3	19.3
Thickness (mm)	1.58	1.58	1.58	1.58	1.58	3.9	3.9
Pitch (mm)	1.27	1.27	1.27	1.27	1.27	2.54	2.54
Max Height (mm)	1.75	1.75	1.75	1.75	1.75	5.08	5.08
Mechanical Data	Herunterladen	Herunterladen	Herunterladen	Herunterladen	Herunterladen	Herunterladen	Herunterladen

Parameters / Models	AM26LS33ACD	AM26LS33ACDG4	AM26LS33ACDR	AM26LS33ACDRE4	AM26LS33ACDRG4	AM26LS33ACN	AM26LS33ACNE4
ICC(Max), mA	70	70	70	70	70	70	70
Operating Temperature Range, C	0 to 70	0 to 70	0 to 70	0 to 70	0 to 70	0 to 70	0 to 70
Package Group	SOIC	SOIC	SOIC	SOIC	SOIC	PDIP	PDIP
Rating	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog
Supply Voltage(s), V	5	5	5	5	5	5	5

	AM26LS33ACD	AM26LS33ACDG4	AM26LS33ACDR	AM26LS33ACDRE4	AM26LS33ACDRG4	AM26LS33ACN	AM26LS33ACNE4
RoHS	Compliant	Compliant	Compliant	Compliant	Compliant	Compliant	Compliant
Pb Free	Yes	Yes

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Wave Solder Exposure of SMT Packages
PDF, 206 Kb, Datei veröffentlicht: Sep 9, 2008
It is common practice to attach surface mount components to the underside of a printed circuit board (PCB) by processing the PCB through a wave soldering operation after gluing the components to the PCB. This paper ummarizes results of several tests performed to understand the performance of surface mount components when exposed to the conditions outlined in JESD22A111.

Serie: AM26LS33A (7)