Datasheet Texas Instruments DM3730CUS100NEP — Datenblatt

HerstellerTexas Instruments
SerieDM3730
ArtikelnummerDM3730CUS100NEP
Datasheet Texas Instruments DM3730CUS100NEP

Digital Media Processor 423-FCBGA 0 bis 90

Datenblätter

DM3730, DM3725 Digital Media Processors datasheet
PDF, 3.3 Mb, Revision: D, Datei veröffentlicht: Apr 11, 2011
Auszug aus dem Dokument

Preise

Status

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityYes

Verpackung

Pin423
Package TypeCUS
Industry STD TermFC/CSP
JEDEC CodeS-PBGA-N
Package QTY90
CarrierJEDEC TRAY (5+1)
Device MarkingDM3730CUS100
Width (mm)16
Length (mm)16
Thickness (mm).96
Pitch (mm).65
Max Height (mm)1.4
Mechanical DataHerunterladen

Parameter

ARM CPU1 ARM Cortex-A8
ARM MHz800,1000 Max.
ApplicationsAudio,Automotive,Communications and Telecom,Computers and Peripherals,Consumer Electronics,Energy,Industrial,Medical,Security
DRAMLPDDR
DSP1 C64x
DSP MHz660,800 Max.
I2C4
On-Chip L2 Cache256 KB (ARM Cortex-A8)
Operating SystemsAndroid,DSP/BIOS,Neutrino,ntegrity,Windows Embedded CE,Linux,VXWorks
Operating Temperature Range-40 to 105,-40 to 90,0 to 90 C
Pin/Package423FCBGA, 515POP-FCBGA
RatingCatalog
SPI4
UART4 SCI
USB4
Video Port1 Dedicated Input,1 Dedicated Output Configurable
Video Resolution/Frame RateD1 or Less,720p

Öko-Plan

RoHSCompliant

Design Kits und Evaluierungsmodule

  • Evaluation Modules & Boards: TMDSEVM3730
    AM/DM37x Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: BEAGLEXM
    BeagleBoard-xM Development Board
    Lifecycle Status: Obsolete (Manufacturer has discontinued the production of the device)

Anwendungshinweise

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    PDF, 19 Kb, Datei veröffentlicht: Jun 3, 2010
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    PDF, 20 Kb, Datei veröffentlicht: Jun 7, 2010
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    PDF, 2.2 Mb, Revision: A, Datei veröffentlicht: May 1, 2004
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    Once the bottom circuit board has been designed the assembly guidelines for package-on-package (PoP) versions of the OMAP35xx processor and the memory device must be considered.

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  • PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors Part II
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  • PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors Part I
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    Ball grid array (BGA) packages having 0.5mm ball pitch require careful attention to printed circuit board (PCB) design parameters to successfully yield reliable and robust assemblies. PCBs with package-on-package (PoP) technology have additional assembly requirements and options that need to be considered when designing the PCB.

    Fine-pitch PCB design is a team effort and may require more than

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  • Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
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Herstellerklassifikation

  • Semiconductors > Processors > Digital Signal Processors > Media Processors > Digital Video Processors