This device is designed specifically to power IMVP Mobile Processors under a strict disclosure
agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For
more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION
www.ti.com 4-Feb-2015 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins
Type Drawing SPQ Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm) B0
(mm) K0
(mm) P1
(mm) W
Pin1
(mm) Quadrant TPS51620RHAR VQFN RHA 40 2500 330.0 16.4 6.3 6.3 1.1 12.0 16.0 Q2 TPS51620RHAT VQFN RHA 40 250 180.0 16.4 6.3 6.3 1.1 12.0 16.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION
www.ti.com 4-Feb-2015 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS51620RHAR VQFN RHA 40 2500 367.0 367.0 38.0 TPS51620RHAT VQFN RHA 40 250 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily …
