Datasheet Texas Instruments X66AK2G02ZBB60 — Datenblatt

HerstellerTexas Instruments
Serie66AK2G02
ArtikelnummerX66AK2G02ZBB60
Datasheet Texas Instruments X66AK2G02ZBB60

Multicore DSP + ARM KeyStone II System-on-Chip (SoC) 625-NFBGA 0 bis 90

Datenblätter

66AK2G0x Multicore DSP+ARM KeyStone II System-on-Chip (SoC) datasheet
PDF, 2.6 Mb, Revision: E, Datei veröffentlicht: Jun 8, 2017
Auszug aus dem Dokument

Preise

Status

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityYes

Verpackung

Pin625
Package TypeZBB
Package QTY1
CarrierJEDEC TRAY (5+1)
Width (mm)21
Length (mm)21
Thickness (mm)1.16
Mechanical DataHerunterladen

Parameter

ARM CPU1 ARM Cortex-A15
ARM MHz600 Max.
ApplicationsCommunications and Telecom,Consumer Electronics,Industrial,Test and Measurement
DRAMDDR3L
DSP1 C66x
DSP MHz600 Max.
EMAC1-port 1Gb,4-port 10/100 PRU EMAC
Hardware Accelerators4 PRU-ICSS,Security Accelerator
I2C3
On-Chip L2 Cache512KB w/ECC ARM Cortex-A15,1024KB w/ECC C66x DSP
Operating SystemsLinux,TI-RTOS
Operating Temperature Range0 to 90 C
Other On-Chip Memory1024KB w/ECC
PCI/PCIePCIe Gen2
RatingCatalog
SPI4
UART3 SCI
USB2

Öko-Plan

RoHSSee ti.com

Design Kits und Evaluierungsmodule

  • Daughter Cards: AUDK2G
    66AK2Gx (K2G) Audio Daughter Card
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: K2GICE
    66AK2Gx (K2G) Industrial Communications Engine (ICE)
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: EVMK2G
    66AK2Gx (K2G) Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)

Anwendungshinweise

  • 66AK2G0x General-Purpose EVM Power Distribution Network Analysis
    PDF, 584 Kb, Datei veröffentlicht: Nov 16, 2016
    The purpose of this application report is to present the flow, the environment settings and methodology used for a performance analysis of critical power nets of a platform using the 66AK2G0x System-on-Chip (SoC) application processor.
  • 66AK2G02 Schematic Checklist
    PDF, 95 Kb, Datei veröffentlicht: Sep 16, 2016
  • 66AK2G02 Power Estimation Tool
    PDF, 27 Kb, Datei veröffentlicht: Jun 15, 2017
    This power estimation spreadsheet provides power consumption estimates based on measured and simulated data; they are provided “as is” and are not ensured within a specified precision. Power consumption depends on electrical parameters, silicon process variations, environmental conditions, and use cases running on the processor during operation. Actual power consumption should be verified in the r
  • Hardware Design Guide for KeyStone II Devices
    PDF, 1.8 Mb, Datei veröffentlicht: Mar 24, 2014
  • SERDES Link Commissioning on KeyStone I and II Devices
    PDF, 138 Kb, Datei veröffentlicht: Apr 13, 2016
    The serializer-deserializer (SerDes) performs serial-to-parallel conversions on data received from a peripheral device and parallel-to-serial conversion on data received from the CPU. This application report explains the SerDes transmit and receive parameters tuning, tools and some debug techniques for TI Keystone I and Keystone II devices.
  • DDR3 Design Requirements for KeyStone Devices (Rev. B)
    PDF, 582 Kb, Revision: B, Datei veröffentlicht: Jun 5, 2014
  • Processor SDK RTOS Audio Benchmark Starter Kit
    PDF, 530 Kb, Datei veröffentlicht: Apr 12, 2017
    The TI TMS320C6000в„ў Digital Signal Processors (DSPs) have many architectural advantages that make them ideal for computation-intensive real-time applications that are commonly used in audio processing application. This application notes describes Audio Benchmark Starterkit software that is intended to provide an easy and quick way to benchmark key audio functions on C66x and C674x DSP device
  • PRU-ICSS Feature Comparison
    PDF, 29 Kb, Datei veröffentlicht: Jun 5, 2017
    This application report documents the feature differences between the PRU subsystems available on different TI processors.
  • TI DSP Benchmarking
    PDF, 62 Kb, Datei veröffentlicht: Jan 13, 2016
    This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms.
  • High-Speed Interface Layout Guidelines (Rev. G)
    PDF, 814 Kb, Revision: G, Datei veröffentlicht: Jul 27, 2017
    As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.

Modellreihe

Serie: 66AK2G02 (1)
  • X66AK2G02ZBB60

Herstellerklassifikation

  • Semiconductors > Processors > Digital Signal Processors > C6000 DSP + ARM Processors > 66AK2x