Datasheet Texas Instruments SN74AVC16244DGVR — Datenblatt
| Hersteller | Texas Instruments |
| Serie | SN74AVC16244 |
| Artikelnummer | SN74AVC16244DGVR |
16-Bit-Puffer / Treiber mit 3-Zustands-Ausgängen 48-TVSOP -40 bis 85
Datenblätter
SN74AVC16244 datasheet
PDF, 831 Kb, Revision: N, Datei veröffentlicht: Jul 21, 2004
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Preise
Status
| Lifecycle Status | Active (Recommended for new designs) |
| Manufacture's Sample Availability | Yes |
Verpackung
| Pin | 48 |
| Package Type | DGV |
| Industry STD Term | TVSOP |
| JEDEC Code | R-PDSO-G |
| Package QTY | 2000 |
| Carrier | LARGE T&R |
| Device Marking | CVA244 |
| Width (mm) | 4.4 |
| Length (mm) | 9.7 |
| Thickness (mm) | 1.05 |
| Pitch (mm) | .4 |
| Max Height (mm) | 1.2 |
| Mechanical Data | Herunterladen |
Parameter
| Bits | 16 |
| F @ Nom Voltage(Max) | 200 Mhz |
| ICC @ Nom Voltage(Max) | 0.04 mA |
| Operating Temperature Range | -40 to 85 C |
| Output Drive (IOL/IOH)(Max) | -12/12 mA |
| Package Group | TVSOP |
| Package Size: mm2:W x L | 48TVSOP: 62 mm2: 6.4 x 9.7(TVSOP) PKG |
| Rating | Catalog |
| Schmitt Trigger | No |
| Technology Family | AVC |
| VCC(Max) | 3.6 V |
| VCC(Min) | 1.2 V |
| Voltage(Nom) | 1.2,1.5,1.8,2.5,3.3 V |
| tpd @ Nom Voltage(Max) | 3.1,3.3,2.9,1.9,1.7 ns |
Öko-Plan
| RoHS | Compliant |
Design Kits und Evaluierungsmodule
- Evaluation Modules & Boards: ADC08100EVM
ADC08100 8-Bit 100MSPS 1.3mW/MSPS Analog-to-Digital Converter (ADC) Evaluation Module
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: ADC08200EVM
ADC08200 8-Bit 200MSPS Low-Power ADC With Internal Sample and Hold Evaluation Module
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: ADC08060EVM
ADC08060 8-Bit 60MSPS 1.3mW/MSPS ADC With Internal Sample and Hold Evaluation Module
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: ADS5232EVM
ADS5232 Dual-Channel, 12-Bit, 65-MSPS Analog-to-Digital Converter Evaluation Module
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: ADS5231EVM
ADS5231 Dual-Channel, 12-Bit, 40-MSPS Analog-to-Digital Converter Evaluation Module
Lifecycle Status: Active (Recommended for new designs)
Anwendungshinweise
- Simultaneous-Switching Performance of TI Logic Devices (Rev. B)PDF, 378 Kb, Revision: B, Datei veröffentlicht: Feb 23, 2005
Simultaneous-switching noise can generate and propagate glitches in electronic systems. Therefore, system designers are faced with challenges to minimize simultaneous-switching noise, while increasing switching speed and improving signal quality. This report presents the performance of different TI logic devices under various simultaneous-switching conditions. Factors such as the number of bits sw - Dynamic Output Control (DOC) Circuitry Technology And Applications (Rev. B)PDF, 126 Kb, Revision: B, Datei veröffentlicht: Jul 7, 1999
Texas Instruments (TI[TM]) next-generation logic is called the Advanced Very-low-voltage CMOS (AVC) family. The AVCfamily features TI?s Dynamic Output Control (DOC[TM]) circuit (patent pending). DOC circuitry automatically lowers the outputimpedance of the circuit at the beginning of a signal transition, providing enough current to achieve high signaling speeds, thensubsequently raises the i - AVC Logic Family Technology and Applications (Rev. A)PDF, 148 Kb, Revision: A, Datei veröffentlicht: Aug 26, 1998
Texas Instruments (TI?) announces the industry?s first logic family to achieve maximum propagation delays of less than 2 ns at 2.5 V. TI?s next-generation logic is the Advanced Very-low-voltage CMOS (AVC) family. Although optimized for 2.5-V systems, AVC logic supports mixed-voltage systems because it is compatible with 3.3-V and 1.8-V devices. The AVC family features TI?s Dynamic Output Control ( - Voltage Translation Between 3.3-V, 2.5-V, 1.8-V, and 1.5-V Logic Standards (Rev. B)PDF, 390 Kb, Revision: B, Datei veröffentlicht: Apr 30, 2015
- 16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)PDF, 895 Kb, Revision: B, Datei veröffentlicht: May 22, 2002
TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa
Modellreihe
Serie: SN74AVC16244 (6)
- 74AVC16244DGGRE4 74AVC16244DGVRG4 SN74AVC16244DGGR SN74AVC16244DGVR SN74AVC16244GQLR SN74AVC16244ZQLR
Herstellerklassifikation
- Semiconductors > Logic > Buffer/Driver/Transceiver > Non-Inverting Buffer/Driver