Datasheet Texas Instruments LM5575MH/NOPB — Datenblatt

HerstellerTexas Instruments
SerieLM5575
ArtikelnummerLM5575MH/NOPB
Datasheet Texas Instruments LM5575MH/NOPB

6 V bis 75 V, 1,5 A breiter Vin-Abwärtsregler 16-HTSSOP -40 bis 125

Datenblätter

LM5575/LM5575Q SIMPLE SWITCHER® 75V, 1.5A Step-Down Switching Regulator datasheet
PDF, 1.1 Mb, Revision: G, Datei veröffentlicht: Apr 4, 2013
Auszug aus dem Dokument

Preise

Status

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityYes

Verpackung

Pin1616
Package TypePWPPWP
Industry STD TermHTSSOPHTSSOP
JEDEC CodeR-PDSO-GR-PDSO-G
Package QTY9292
CarrierTUBETUBE
Device MarkingLM5575MH
Width (mm)4.44.4
Length (mm)55
Thickness (mm)11
Pitch (mm).65.65
Max Height (mm)1.21.2
Mechanical DataHerunterladenHerunterladen

Parameter

Control ModeCurrent Mode
Duty Cycle(Max)95 %
Iout(Max)1.5 A
Iq(Typ)1 mA
Operating Temperature Range-40 to 125 C
Package GroupHTSSOP
RatingCatalog
Regulated Outputs1
Special FeaturesEnable,Tracking
Switching Frequency(Max)500 kHz
Switching Frequency(Min)50 kHz
TypeConverter
Vin(Max)75 V
Vin(Min)6 V
Vout(Max)70 V
Vout(Min)1.23 V

Öko-Plan

RoHSCompliant

Design Kits und Evaluierungsmodule

  • Evaluation Modules & Boards: LM5575EVAL
    75V, 1.5A Step-Down Switching Regulator Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)

Anwendungshinweise

  • Understanding and Applying Current-Mode Control Theory
    PDF, 409 Kb, Datei veröffentlicht: Aug 19, 2007
  • AN-643 EMI/RFI Board Design (Rev. B)
    PDF, 742 Kb, Revision: B, Datei veröffentlicht: May 3, 2004
    Application Note 643 EMI/RFI Board Design
  • Input and Output Capacitor Selection
    PDF, 219 Kb, Datei veröffentlicht: Sep 19, 2005
  • AN-1197 Selecting Inductors for Buck Converters (Rev. B)
    PDF, 558 Kb, Revision: B, Datei veröffentlicht: Apr 23, 2013
    This application report provides design information to help select an off-the-shelf inductor for anycontinuous-mode buck converter application.
  • AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)
    PDF, 3.6 Mb, Revision: A, Datei veröffentlicht: Apr 23, 2013
    This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
  • AN-1566 Techniques for Thermal Analysis of Switching Power Supply Designs (Rev. A)
    PDF, 1.4 Mb, Revision: A, Datei veröffentlicht: Apr 23, 2013
    This application note provides thermal power analysis techniques for analyzing the power IC.
  • AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A)
    PDF, 2.7 Mb, Revision: A, Datei veröffentlicht: Apr 23, 2013
    This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time.
  • Semiconductor and IC Package Thermal Metrics (Rev. C)
    PDF, 201 Kb, Revision: C, Datei veröffentlicht: Apr 19, 2016
  • AN-1997 Error Amplifier Limitations in High-Performance Regulator Applications (Rev. A)
    PDF, 153 Kb, Revision: A, Datei veröffentlicht: May 6, 2013
    The development of realistic predictions to assist the power supply engineer during the control loop design process is facilitated in this application report by appropriate small-signal and bode plot analysis, the validity of which is verified through simulation results.
  • Quick Start Guide for a 1.5 Amp Buck Regulator Using the LM5575 and LM25575 (Rev. B)
    PDF, 63 Kb, Revision: B, Datei veröffentlicht: Apr 23, 2013
    This application note provides an easy to use process to help users design a 1.5 Amp buck regular usingthe LM5575 and LM25575 switching regulators.
  • Low EMI Layout Made SIMPLE With LM43600/1/2/3 and LM46000/1/2 (Rev. A)
    PDF, 512 Kb, Revision: A, Datei veröffentlicht: Sep 12, 2014
    Printed Circuit Board (PCB) layout for Switched Mode Power Supplies (SMPS) is critical to achieve proper converter operation good thermal performance and excellent radiated EMI performance. Optimized board layout for low radiated EMI is made very simple by the package and pin arrangement of the SIMPLE SWITCHER Synchronous Buck Converter family LM4360x and LM4600x
  • AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)
    PDF, 82 Kb, Revision: C, Datei veröffentlicht: Apr 23, 2013
    When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current
  • AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)
    PDF, 374 Kb, Revision: C, Datei veröffentlicht: Apr 23, 2013
    This application report provides SIMPLE SWITCHER™ PCB layout guidelines.
  • AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)
    PDF, 2.5 Mb, Revision: C, Datei veröffentlicht: Apr 24, 2013
    Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti
  • AN-1246 Stresses in Wide Input DC-DC Converters (Rev. C)
    PDF, 427 Kb, Revision: C, Datei veröffentlicht: Apr 23, 2013
    This application note discusses stresses in wide input DC-DC converters.
  • AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)
    PDF, 9.2 Mb, Revision: B, Datei veröffentlicht: Apr 23, 2013
    This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP

Modellreihe

Serie: LM5575 (4)

Herstellerklassifikation

  • Semiconductors > Power Management > Non-isolated DC/DC Switching Regulator > Step-Down (Buck) > Buck Converter (Integrated Switch)