Datasheet Texas Instruments TPS79318YZQT — Datenblatt

HerstellerTexas Instruments
SerieTPS793
ArtikelnummerTPS79318YZQT
Datasheet Texas Instruments TPS79318YZQT

Hohe PSRR, rauscharm, 200 mA LDO mit Einzelausgang, 5-DSBGA -40 bis 125

Datenblätter

TPS793 Low-Noise, High PSRR, RF, 200-mA Low-Dropout Linear Regulators in NanoStarв„ў Wafer Chip Scale and SOT-23 datasheet
PDF, 1.2 Mb, Revision: L, Datei veröffentlicht: Aug 7, 2014
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Preise

Status

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityNo

Verpackung

Pin5
Package TypeYZQ
Industry STD TermDSBGA
JEDEC CodeR-XBGA-N
Package QTY250
CarrierSMALL T&R
Device MarkingE3
Thickness (mm).45
Pitch (mm).5
Max Height (mm).6
Mechanical DataHerunterladen

Parameter

Accuracy2 %
Fixed Output Options1.8,2.5,2.8,2.85,3,3.3,4.75 V
Iout(Max)0.2 A
Iq(Typ)0.17 mA
Noise32 uVrms
Operating Temperature Range-40 to 125 C
Output Capacitor TypeCeramic
Output OptionsAdjustable Output,Fixed Output
PSRR @ 100KHz44 dB
Package GroupDSBGA
Package Size: mm2:W x LSee datasheet (DSBGA) PKG
RatingCatalog
Regulated Outputs1
Special FeaturesEnable
Thermal Resistance ОёJA178 В°C/W
Vdo(Typ)112 mV
Vin(Max)5.5 V
Vin(Min)2.7 V
Vout(Max)5.4 V
Vout(Min)1.22 V

Öko-Plan

RoHSCompliant

Design Kits und Evaluierungsmodule

  • Evaluation Modules & Boards: TMDXEVM368
    TMS320DM36x Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: TPS793285YEQEVM
    TPS793285Y Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: TPS79325YEQEVM
    Evaluation Module for TPS79325 chipscale LDO
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: TPS79330YEQEVM
    Evaluation Module for TPS79330 chipscale LDO
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: TPS79328EVM
    TPS79328 Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: TPS79301EVM
    TPS79301 Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: DEM-SOT23LDO
    DEM-SOT23LDO Compatible With Most Positive-Output LDO Regulators in 5- or 6-Lead SOT23 (DBV) Package
    Lifecycle Status: Active (Recommended for new designs)

Anwendungshinweise

  • NanoStarв„ў Wafer Chip-Scale Package Design Guide
    PDF, 286 Kb, Datei veröffentlicht: Sep 5, 2003
    To satisfy market demand for an ultra-small, staggered 5-ball wafer-level chip-scale package, TI has introduced the 170Ојm NanoStar YEQ package. Since staggered ball WCSPs are not registered under the JEDEC MO-211 standard, there are no formal industry-standard guidelines on proper use of devices in this package. This application note gives guidelines for reliable, high-performance use of the YE
  • NanoStarв„ў & NanoFreeв„ў 300Ојm Solder Bump WCSP Application
    PDF, 749 Kb, Datei veröffentlicht: Feb 2, 2004
    The NanoStarв„ў Wafer Chip-Scale Package (WCSP) is a family of bare die packages developed for applications that require the smallest possible package. WCSP provides electrical interconnection via solder spheres attached to the die and is aligned with JEDEC package standard MOв€’211. NanoStarв„ў, with advanced materials engineering technology, has demonstrated excellent board level rel
  • Cycloneв„ў III FPGA Starter Kit Power Reference Design
    PDF, 314 Kb, Datei veröffentlicht: Mar 27, 2008
    This power supply was designed to power the 3C25F324 starter kit. This reference design has many benefits over the existing power supply found on the starter kit demonstration board.

Modellreihe

Herstellerklassifikation

  • Semiconductors > Power Management > Linear Regulator (LDO) > Single Channel LDO