Datasheet Texas Instruments MSP430F5659IZQWT — Datenblatt

HerstellerTexas Instruments
SerieMSP430F5659
ArtikelnummerMSP430F5659IZQWT
Datasheet Texas Instruments MSP430F5659IZQWT

MSP430F56xx Mixed-Signal-Mikrocontroller 113-BGA MICROSTAR JUNIOR -40 bis 85

Datenblätter

MSP430F665x, MSP430F645x, MSP430F565x, MSP430F535x Mixed Signal Microcontroller datasheet
PDF, 1.9 Mb, Revision: C, Datei veröffentlicht: Oct 21, 2013
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Preise

Status

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityNo

Verpackung

Pin113
Package TypeZQW
Industry STD TermBGA MICROSTAR JUNIOR
JEDEC CodeS-PBGA-N
Package QTY250
CarrierSMALL T&R
Device MarkingF5659
Width (mm)7
Length (mm)7
Thickness (mm).74
Pitch (mm).5
Max Height (mm)1
Mechanical DataHerunterladen

Parameter

ADCADC12 - 12ch
AESN/A
Active Power370 uA/MHz
Additional FeaturesUSB,Real-Time Clock,Watchdog,DAC,Temp Sensor,Brown Out Reset,IrDA
BSLUSB
CPUMSP430
Comparators12
DMA6
Featuredf5
Frequency20 MHz
GPIO Pins74
I2C3
Max VCC3.6
Min VCC1.8
Multiplier32x32
Non-volatile Memory512 KB
Operating Temperature Range-40 to 85 C
Package GroupBGA MICROSTAR JUNIOR
Package Size: mm2:W x L113BGA MICROSTAR JUNIOR: 49 mm2: 7 x 7(BGA MICROSTAR JUNIOR) PKG
RAM66 KB
RatingCatalog
SPI6
Special I/ON/A
Standby Power2.6 LPM3-uA
Timers - 16-bit4
UART3
Wakeup Time3 us

Öko-Plan

RoHSCompliant

Design Kits und Evaluierungsmodule

  • Evaluation Modules & Boards: CC2564MODAEM
    Dual-mode BluetoothВ® CC2564 Module with Integrated Antenna Evaluation Board
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: MSP-EXP430F5529LP
    MSP430F5529 USB LaunchPad Evaluation Kit
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: MSP-FET430U100USB
    100-pin Target Development Board and MSP-FET Programmer Bundle for MSP430F5x and MSP430F6x MCUs
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: ENERGYTRACE
    MSP EnergyTrace Technology
    Lifecycle Status: Active (Recommended for new designs)

Anwendungshinweise

  • Using the MSP430 RTC_B Module With Battery Backup Supply (Rev. B)
    PDF, 135 Kb, Revision: B, Datei veröffentlicht: Jun 4, 2015
    Some applications need to retain an accurate real-time clock (RTC) through battery changes, power outages, and other events. For these applications, MSP430в„ў devices that contain the RTC_B Real-Time Clock module with a Battery Backup System can be a great fit. This application note demonstrates how to use RTC_B with Battery Backup Supply functionality to retain the time and keep the RTC counting th
  • Starting a USB Design Using MSP430 MCUs (Rev. A)
    PDF, 949 Kb, Revision: A, Datei veröffentlicht: May 30, 2014
    This document is a high-level starting point for those wanting to design USB devices with MSP430в„ў MCUs. It provides an overview of the TI MSP430 hardware and software offerings for USB, as well as guidance in quickly getting started.Among the topics covered:An overview of the MSP430 hardware USB moduleAn introduction to the MSP430 USB Developer's Package
  • Using the MSP430 Timer_D Module in Hi-Resolution Mode
    PDF, 870 Kb, Datei veröffentlicht: Oct 2, 2013
    This application report describes the use of the high-resolution feature of the Timer_D module introduced in MSP430F51x1 and MSP430F51x2 devices. Timer_D enables applications that require high resolution such as capacitive touch detection, PWM DACs, advanced LED lighting, and digital controllers for power supplies. This application report provides an advanced description of the use and calibration
  • General Oversampling of MSP ADCs for Higher Resolution (Rev. A)
    PDF, 551 Kb, Revision: A, Datei veröffentlicht: Apr 1, 2016
    Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl
  • MSP Code Protection Features
    PDF, 752 Kb, Datei veröffentlicht: Dec 7, 2015
    MSP microcontrollers (MCUs) offer a number of features to help control code accessibility in the device, to add different layers of code access management and protection strategies. These include features that can lock or password protect the JTAG/SBW access, IP Encapsulation (IPE) to isolate sensitive code with different permissions than the rest of the program, and bootloader (BSL) access featur
  • ESD Diode Current Specification
    PDF, 520 Kb, Datei veröffentlicht: Dec 7, 2015
    This document explains the maximum ESD diode current specified for GPIO on MSP microcontrollers. Sometimes signals on specific pins exceed the supply of the MSP MCU. In such a case, the device can handle this overvoltage condition through the ESD diodes, but the ESD diode specification must be considered during application design. The items to be considered are described in this document.

Modellreihe

Herstellerklassifikation

  • Semiconductors > Microcontrollers (MCU) > MSP430 ultra-low-power MCUs > MSP430F5x/6x