Datasheet Texas Instruments 66AK2E05XABD25 — Datenblatt

HerstellerTexas Instruments
Serie66AK2E05
Artikelnummer66AK2E05XABD25
Datasheet Texas Instruments 66AK2E05XABD25

Multicore DSP + ARM KeyStone II System-on-Chip (SoC) 1089-FCBGA 0 bis 85

Datenblätter

66AK2E05/02 Multicore DSP+ARM KeyStone II System-on-Chip (SoC) datasheet
PDF, 2.0 Mb, Revision: D, Datei veröffentlicht: Mar 11, 2015
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Preise

Status

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityYes

Verpackung

Pin10891089
Package TypeABDABD
Package QTY4040
CarrierJEDEC TRAY (5+1)JEDEC TRAY (5+1)
Device Marking@2012 TI66AK2E05XABD
Width (mm)2727
Length (mm)2727
Thickness (mm)2.982.98
Mechanical DataHerunterladenHerunterladen

Parameter

ARM CPU4 ARM Cortex-A15
ARM MHz1250,1400 Max.
ApplicationsAvionics and Defense,Communications and Telecom,Consumer Electronics,Industrial,Medical,Security,Space
DRAMDDR3,DDR3L
DSP1 C66x
DSP MHz1250,1400 Max.
EMAC2-Port 10Gb Switch,8-Port 1Gb Switch
Hardware AcceleratorsSecurity Accelerator,Packet Accelerator
I2C3
On-Chip L2 Cache4096 KB (ARM Cluster),512 KB (per C66x DSP core)
Operating SystemsIntegrity,Linux,SYS/BIOS,VxWorks
Operating Temperature Range0 to 85,-40 to 100 C
Other On-Chip Memory2048 KB
PCI/PCIe4 PCIe Gen2
RatingCatalog
SPI3
UART2 SCI
USB2

Öko-Plan

RoHSCompliant

Design Kits und Evaluierungsmodule

  • JTAG Emulators/ Analyzers: TMDSEMU560V2STM-UE
    XDS560v2 System Trace USB & Ethernet Debug Probe
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: TMDSEMU560V2STM-U
    XDS560v2 System Trace USB Debug Probe
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: XEVMK2EX
    K2E Development Board
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: EVMK2EX
    K2E Development Board
    Lifecycle Status: Preview (Device has been announced but is not in production. Samples may or may not be available)
  • JTAG Emulators/ Analyzers: TMDSEMU200-U
    XDS200 USB Debug Probe
    Lifecycle Status: Active (Recommended for new designs)

Anwendungshinweise

  • Power Consumption Summary for K2E System-on-Chip (SoC) Device Family
    PDF, 65 Kb, Datei veröffentlicht: Jun 14, 2017
    This application report discusses estimating the power consumption of Texas Instruments' K2Ex Digital Signal Processors (DSP) using a provided device-specific power spreadsheet. It should be noted that the power model is applicable for all silicon revisions.
  • Clocking Spreadsheet for K2E Device Family
    PDF, 22 Kb, Datei veröffentlicht: Jan 26, 2017
    This document discusses the internal clocking architecture of Texas Instruments K2Ex Digital Signal Processors (DSP) using a provided clocking spreadsheet.The 66AK2Ex and AM5K2Ex devices have similar internal clocking architecture and peripherals except the corepac. The 66AK2Ex devices have both DSP corepac and ARM corepac, whereas, the AM5K2Ex devices have ARM corepac only.Use the K
  • PCI Express (PCIe) Resource Wiki for Keystone Devices (Rev. A)
    PDF, 57 Kb, Revision: A, Datei veröffentlicht: May 19, 2017
  • Keystone II DDR3 Initialization
    PDF, 73 Kb, Datei veröffentlicht: Jan 26, 2015
    This application report provides a step-to-step initialization guide for the Keystone II device DDR3 SDRAM controller.
  • Throughput Performance Guide for KeyStone II Devices (Rev. B)
    PDF, 866 Kb, Revision: B, Datei veröffentlicht: Dec 22, 2015
    This application report analyzes various performance measurements of the KeyStone II family of processors. It provides a throughput analysis of the various support peripherals to different end-points and memory access.
  • Keystone II DDR3 Debug Guide
    PDF, 143 Kb, Datei veröffentlicht: Oct 16, 2015
    This guide provides tools for use when debugging a failing DDR3 interface on a KeyStone II device.
  • Power Management of KS2 Device (Rev. C)
    PDF, 61 Kb, Revision: C, Datei veröffentlicht: Jul 15, 2016
    This application report lists the steps to enable Class 0 Temperature Compensation (Class 0 TC) mode of SmartReflexв„ў Subsystem (SRSS) module available on such devices.
  • Hardware Design Guide for KeyStone II Devices
    PDF, 1.8 Mb, Datei veröffentlicht: Mar 24, 2014
  • SERDES Link Commissioning on KeyStone I and II Devices
    PDF, 138 Kb, Datei veröffentlicht: Apr 13, 2016
    The serializer-deserializer (SerDes) performs serial-to-parallel conversions on data received from a peripheral device and parallel-to-serial conversion on data received from the CPU. This application report explains the SerDes transmit and receive parameters tuning, tools and some debug techniques for TI Keystone I and Keystone II devices.
  • PCIe Use Cases for KeyStone Devices
    PDF, 320 Kb, Datei veröffentlicht: Dec 13, 2011
  • Clocking Design Guide for KeyStone Devices
    PDF, 1.5 Mb, Datei veröffentlicht: Nov 9, 2010
  • The C6000 Embedded Application Binary Interface Migration Guide (Rev. A)
    PDF, 20 Kb, Revision: A, Datei veröffentlicht: Nov 10, 2010
    The C6000 compiler tools support a new ELF-based ABI named EABI. Prior to this time, the compiler only supported a single ABI, which is now named COFF ABI. The following compelling best-in-class features are available under the C6000 EABI:GeneralZero-init globals: “int gvar;” gets set to 0 before main runs.Dynamic linking: Add code to a running system.Native ROM
  • Optimizing Loops on the C66x DSP
    PDF, 585 Kb, Datei veröffentlicht: Nov 9, 2010
  • DDR3 Design Requirements for KeyStone Devices (Rev. B)
    PDF, 582 Kb, Revision: B, Datei veröffentlicht: Jun 5, 2014
  • Multicore Programming Guide (Rev. B)
    PDF, 1.8 Mb, Revision: B, Datei veröffentlicht: Aug 29, 2012
    As application complexity continues to grow, we have reached a limit on increasing performance by merely scaling clock speed. To meet the ever-increasing processing demand, modern System-On-Chip solutions contain multiple processing cores. The dilemma is how to map applications to multicore devices. In this paper, we present a programming methodology for converting applications to run on multicore
  • Processor SDK RTOS Audio Benchmark Starter Kit
    PDF, 530 Kb, Datei veröffentlicht: Apr 12, 2017
    The TI TMS320C6000в„ў Digital Signal Processors (DSPs) have many architectural advantages that make them ideal for computation-intensive real-time applications that are commonly used in audio processing application. This application notes describes Audio Benchmark Starterkit software that is intended to provide an easy and quick way to benchmark key audio functions on C66x and C674x DSP device
  • TI DSP Benchmarking
    PDF, 62 Kb, Datei veröffentlicht: Jan 13, 2016
    This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms.

Modellreihe

Herstellerklassifikation

  • Semiconductors > Processors > Digital Signal Processors > C6000 DSP + ARM Processors > 66AK2x