Datasheet Texas Instruments AM26LV32INSG4 — Datenblatt

HerstellerTexas Instruments
SerieAM26LV32
ArtikelnummerAM26LV32INSG4
Datasheet Texas Instruments AM26LV32INSG4

Niederspannungs-Hochgeschwindigkeits-Vierfach-Differenzleitungsempfänger 16-SO -40 bis 85

Datenblätter

AM26LV32 Low-Voltage, High-Speed Quadruple Differential Line Receiver datasheet
PDF, 1.0 Mb, Revision: F, Datei veröffentlicht: Nov 18, 2016
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Preise

Status

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityNo

Verpackung

Pin16
Package TypeNS
Industry STD TermSOP
JEDEC CodeR-PDSO-G
Package QTY50
CarrierTUBE
Device Marking26LV32I
Width (mm)5.3
Length (mm)10.3
Thickness (mm)1.95
Pitch (mm)1.27
Max Height (mm)2
Mechanical DataHerunterladen

Parameter

ICC(Max)17 mA
Operating Temperature Range-40 to 85,0 to 70 C
Package GroupSO
RatingCatalog
Signaling Rate32 Mbps
Supply Voltage(s)3.3 V

Öko-Plan

RoHSCompliant

Anwendungshinweise

  • Wave Solder Exposure of SMT Packages
    PDF, 206 Kb, Datei veröffentlicht: Sep 9, 2008
    It is common practice to attach surface mount components to the underside of a printed circuit board (PCB) by processing the PCB through a wave soldering operation after gluing the components to the PCB. This paper ummarizes results of several tests performed to understand the performance of surface mount components when exposed to the conditions outlined in JESD22A111.

Modellreihe

Herstellerklassifikation

  • Semiconductors > Interface > RS-485/RS-422