Datasheet Texas Instruments CD4093BM — Datenblatt

Data sheet acquired from Harris Semiconductor
SCHS115D – Revised September 2003 The CD4093B types are supplied in 14-lead
hermetic dual-in-line ceramic packages (F3A
suffix), 14-lead dual-in-line plastic packages (E
suffix), 14-lead small-outline packages (M, MT,
M96, and NSR suffixes), and 14-lead thin shrink
small-outline packages (PW and PWR suffixes). PACKAGE THERMAL IMPEDANCE, ОёJA (See Note 1):
E package .
M package .
NS package NOTE 1: . 80В°C/W
86В°C/W
76В°C/W Package thermal impedance is calculated in accordance with JESD 51-7. VDD VDD VOH VP
VN
VOL VSS Copyright пЈ© 2003 Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters. POST OFFICE BOX 655303 DALLAS, TEXAS 75265 1 2 POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 655303 DALLAS, TEXAS 75265 3 4 POST OFFICE BOX 655303 DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 1-Jun-2017 PACKAGING INFORMATION
Orderable Device Status
(1) Package Type Package Pins Package
Drawing
Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (В°C) Device Marking
(4/5) 7704602CA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 7704602CA
CD4093BF3A CD4093BE ACTIVE PDIP N 14 25 Pb-Free …