Datasheet Texas Instruments LMR64010XMF/NOPB — Datenblatt

HerstellerTexas Instruments
SerieLMR64010
ArtikelnummerLMR64010XMF/NOPB
Datasheet Texas Instruments LMR64010XMF/NOPB

SIMPLE SWITCHER® 2,7 V bis 14 V, 1A Step-Up-Regler im SOT-23-Paket 5-SOT-23 -40 bis 125

Datenblätter

LMR64010 SIMPLE SWITCHER ® 40Vout, 1A Step-Up Voltage Regulator in SOT-23 datasheet
PDF, 1.1 Mb, Revision: B, Datei veröffentlicht: Apr 4, 2013
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Preise

Status

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityYes

Verpackung

Pin5
Package TypeDBV
Industry STD TermSOT-23
JEDEC CodeR-PDSO-G
Package QTY1000
CarrierLARGE T&R
Device MarkingSF9B
Width (mm)1.6
Length (mm)2.9
Thickness (mm)1.2
Pitch (mm).95
Max Height (mm)1.45
Mechanical DataHerunterladen

Parameter

Duty Cycle(Max)93 %
Iq(Typ)2.1 mA
Operating Temperature Range-40 to 125 C
Package GroupSOT-23
RatingCatalog
Regulated Outputs1
Special FeaturesEnable
Switch Current Limit(Min)1 A
Switch Current Limit(Typ)1.5 A
Switching Frequency(Max)1600 kHz
Switching Frequency(Min)1600 kHz
TypeConverter
Vin(Max)14 V
Vin(Min)2.7 V
Vout(Max)40 V
Vout(Min)3 V

Öko-Plan

RoHSCompliant

Design Kits und Evaluierungsmodule

  • Evaluation Modules & Boards: LMR64010XMFDEMO
    LMR64010 SIMPLE SWITCHERВ® 40Vout, 1A Step-Up Regulator in SOT-23 Demo Board
    Lifecycle Status: Active (Recommended for new designs)

Anwendungshinweise

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  • AN-643 EMI/RFI Board Design (Rev. B)
    PDF, 742 Kb, Revision: B, Datei veröffentlicht: May 3, 2004
    Application Note 643 EMI/RFI Board Design
  • Working With Boost Converters
    PDF, 159 Kb, Datei veröffentlicht: Jun 15, 2015
    This brief note highlights some of the more common pitfalls when using boost regulators. These includemaximum achievable output current and voltage, short circuit behavior and basic layout issues. It isassumed that the reader is familiar with the basic operation of a boost regulator.
  • Input and Output Capacitor Selection
    PDF, 219 Kb, Datei veröffentlicht: Sep 19, 2005
  • Basic Calculation of a Boost Converter's Power Stage (Rev. C)
    PDF, 186 Kb, Revision: C, Datei veröffentlicht: Jan 8, 2014
    This application note gives the equations to calculate the power stage of a boost converter built with an IC with integrated switch and operating in continuous conduction mode. It is not intended to give details on the functionality of a boost converter (see Reference 1) or how to compensate a converter. See the references at the end of this document if more detail is needed.
  • AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)
    PDF, 3.6 Mb, Revision: A, Datei veröffentlicht: Apr 23, 2013
    This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
  • AN-1566 Techniques for Thermal Analysis of Switching Power Supply Designs (Rev. A)
    PDF, 1.4 Mb, Revision: A, Datei veröffentlicht: Apr 23, 2013
    This application note provides thermal power analysis techniques for analyzing the power IC.
  • AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A)
    PDF, 2.7 Mb, Revision: A, Datei veröffentlicht: Apr 23, 2013
    This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time.
  • Semiconductor and IC Package Thermal Metrics (Rev. C)
    PDF, 201 Kb, Revision: C, Datei veröffentlicht: Apr 19, 2016
  • Inverted SEPIC Made SIMPLE
    PDF, 408 Kb, Datei veröffentlicht: Jul 31, 2015
    There can be quite a few applications that require a conversion from a negative input voltage to a negativeoutput voltage and there are a few ways to go about doing it. The telecom industry is one such examplewhere the rails are usually negative. This design space along with being limited is not well explored. In thisapplication note we will go over the use of an integrated boost regulator i
  • AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)
    PDF, 82 Kb, Revision: C, Datei veröffentlicht: Apr 23, 2013
    When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current
  • Understanding Boost Power Stages In Switchmode Power Supplies
    PDF, 149 Kb, Datei veröffentlicht: Mar 4, 1999
    A switching power supply consists of the power stage and the control circuit. The power stage performs the basic power conversion from the input voltage to the output voltage and includes switches and the output filter. This report addresses the boost power stage only and does not cover control circuits. The report includes detailed steady-stage and small-signal analysis of the boost power stage o
  • AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)
    PDF, 374 Kb, Revision: C, Datei veröffentlicht: Apr 23, 2013
    This application report provides SIMPLE SWITCHER™ PCB layout guidelines.
  • AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)
    PDF, 2.5 Mb, Revision: C, Datei veröffentlicht: Apr 24, 2013
    Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti
  • AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)
    PDF, 9.2 Mb, Revision: B, Datei veröffentlicht: Apr 23, 2013
    This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP

Modellreihe

Serie: LMR64010 (3)

Herstellerklassifikation

  • Semiconductors > Power Management > Non-isolated DC/DC Switching Regulator > Step-Up (Boost) > Boost Converter (Integrated Switch)