Datasheet Texas Instruments DM3725CBPA — Datenblatt

HerstellerTexas Instruments
SerieDM3725
ArtikelnummerDM3725CBPA
Datasheet Texas Instruments DM3725CBPA

Digital Media Processor 515-POP-FCBGA -40 bis 105

Datenblätter

DM3730, DM3725 Digital Media Processors datasheet
PDF, 3.3 Mb, Revision: D, Datei veröffentlicht: Apr 11, 2011
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Preise

Status

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityYes

Verpackung

Pin515
Package TypeCBP
Industry STD TermPOP-FCBGA
JEDEC CodeS-PBGA-N
Package QTY168
Device MarkingDM3725CBPA
Width (mm)12
Length (mm)12
Thickness (mm).5
Pitch (mm).4
Max Height (mm).7
Mechanical DataHerunterladen

Parameter

ARM CPU1 ARM Cortex-A8
ARM MHz800,1000 Max.
ApplicationsAudio,Automotive,Communications and Telecom,Computers and Peripherals,Consumer Electronics,Energy,Industrial,Medical,Security
DRAMLPDDR
DSP1 C64x
DSP MHz660,800 Max.
I2C4
On-Chip L2 Cache256 KB (ARM Cortex-A8)
Operating SystemsAndroid,DSP/BIOS,Neutrino,Integrity,Windows Embedded CE,Linux,VxWorks
Operating Temperature Range-40 to 105,-40 to 90,0 to 90 C
Pin/Package423FCBGA, 515POP-FCBGA
RatingCatalog
SPI4
UART4 SCI
USB4
Video Port1 Dedicated Input,1 Dedicated Output Configurable
Video Resolution/Frame RateD1 or Less,720p

Öko-Plan

RoHSCompliant

Design Kits und Evaluierungsmodule

  • Evaluation Modules & Boards: BEAGLEXM
    BeagleBoard-xM Development Board
    Lifecycle Status: Obsolete (Manufacturer has discontinued the production of the device)
  • Evaluation Modules & Boards: TMDSEVM3730
    AM/DM37x Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: TMDSEMU200-U
    XDS200 USB Debug Probe
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: TMDSEMU560V2STM-UE
    XDS560v2 System Trace USB & Ethernet Debug Probe
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: TMDSEMU560V2STM-U
    XDS560v2 System Trace USB Debug Probe
    Lifecycle Status: Active (Recommended for new designs)

Anwendungshinweise

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    PDF, 19 Kb, Datei veröffentlicht: Jun 3, 2010
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    PDF, 20 Kb, Datei veröffentlicht: Jun 7, 2010
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    PDF, 1.2 Mb, Datei veröffentlicht: Jun 23, 2010
    Once the main printed circuit board (PCB) has been designed the assembly guidelines for the 0.5mm package-on-package (PoP) applications processor and companion memory device must be considered. PoP applications processors have an enormous number of variables associated with assembly. The following factors have a major effect on the quality and reliability of PCB assembly: PoP applications process
  • PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors Part I
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Herstellerklassifikation

  • Semiconductors > Processors > Digital Signal Processors > Media Processors > Digital Video Processors